Substrate Support Stage Flow Control for Multi-Zone Temperature Uniformity

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in precisely controlling the temperature of substrates across multiple zones, leading to inconsistent temperature management and reduced independent controllability.

Innovation Solution

The apparatus includes a substrate support stage with recesses, supply and collection pipes, and flow rate adjusting valves, allowing for the precise control of heat transfer medium flow rates and positions to adjust substrate temperatures, enabling independent temperature control across multiple zones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat transfer medium is supplied to substrate support stage to control temperature, then temperature control capability is improved, but independent controllability across multiple zones deteriorates

Engineering Contradiction:
Improvesubstrate temperature controlVSAvoidindependent temperature control across zones
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The substrate support stage is divided into multiple independent temperature control zones, each with its own recess, supply pipe, and flow rate adjusting valve. This segmentation allows each zone to control heat transfer medium flow independently, enabling separate temperature adjustment for different substrate regions without affecting other zones.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each zone is equipped with dedicated flow rate adjusting valves and supply pipes that can be individually controlled. This local quality approach ensures that temperature control parameters can be optimized independently for each zone based on specific substrate processing requirements, achieving both temperature control and independent adaptability.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If multiple zones are controlled independently with separate supply pipes and valves, then independent controllability is improved, but device complexity increases

Engineering Contradiction:
Improveindependent temperature control across zonesVSAvoidnumber of supply pipes and flow rate adjusting valves
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The supply pipes and flow rate adjusting valves are integrated into a unified system architecture where each component serves multiple functions. The supply pipes deliver heat transfer medium to multiple zones, and the flow rate adjusting valves can be controlled collectively or individually, allowing the system to operate in both independent and coordinated modes, thereby managing complexity while maintaining versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for precise and independent temperature control of substrates across multiple zones, maintaining consistent temperature management and enhancing controllability, even when changes occur in one zone without affecting others.

Implementation Method 1

The substrate support provides at least one recess that opens downward. The at least one supply pipe includes an opening end that opens upward in the at least one recess. The at least one supply pipe is configured to supply a heat transfer medium to the at least one recess.

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20240079215A1Substrate processing apparatus
Publication Date: 2024.03.07 TOKYO ELECTRON LTD
  • US20240079215A1 patent drawing
  • US20240079215A1 patent drawing
  • US20240079215A1 patent drawing

AI summary

A disclosed substrate processing apparatus includes a processing chamber, a substrate support stage. The substrate support provides at least one recess. The at least one recess opens downward. The at least one supply pipe is configured to supply a heat transfer medium to the at least one recess. The at least one partition forms at least one space together with the substrate support stage. The at least one space include the at least one recess. The at least one collection pipe is configured to collect the heat transfer medium from the at least one space. The at least one flow rate adjusting valve that is connected to the at least one supply pipe. The controller is configured to control the at least one flow rate adjusting valve to adjust a flow rate of the heat transfer medium supplied to the at least one supply pipe.