Substrate Stage Temperature Control Using Heat Transfer Gas Pressure
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining consistent substrate temperature control due to wear and changes in heat transfer characteristics over time, affecting process results.
Innovation Solution
A temperature controlling method that adjusts both the temperature of a temperature-controlling medium and the pressure of heat transfer gas to maintain precise temperature control for each process by using a substrate processing apparatus with a flow path for the medium and discharge ports for gas, employing a controller to manage these adjustments based on acquired substrate and gas pressures and temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only temperature of temperature-controlling medium is adjusted, then temperature control is simplified, but substrate temperature cannot be precisely controlled for each process
Solution Approach 1:
The system changes multiple parameters simultaneously - both the temperature of the temperature-controlling medium and the pressure of the heat transfer gas - to achieve precise substrate temperature control for each process. This multi-parameter adjustment allows independent optimization of temperature control for different process requirements
Solution Approach 2:
The system dynamically adjusts both temperature and pressure parameters based on process requirements. The controller modifies the temperature of the temperature-controlling medium and the pressure of the heat transfer gas in real-time to maintain precise substrate temperature control across different processes
2Device complexity
If heat transfer gas pressure is not adjusted, then control system is simpler, but substrate temperature changes cannot be corrected for each process
Solution Approach 1:
The system utilizes pressure changes of the heat transfer gas as an additional control parameter to correct substrate temperature variations for each process. By adjusting gas pressure alongside temperature, the system achieves better process consistency and reliability
Solution Approach 2:
The controller uses feedback from substrate temperature measurements to adjust both temperature-controlling medium temperature and heat transfer gas pressure. This feedback mechanism ensures that substrate temperature is maintained within required specifications for each process
3Ease of operation
If temperature-controlling medium temperature is not adjusted, then control is easier, but substrate temperature drift occurs over time
Solution Approach 1:
The system automatically adjusts the temperature of the temperature-controlling medium to compensate for substrate temperature drift over time. This parameter adjustment maintains substrate temperature stability without requiring manual intervention
Solution Approach 2:
The temperature control system operates autonomously, automatically adjusting the temperature-controlling medium temperature and heat transfer gas pressure to maintain substrate temperature stability. The controller self-regulates based on process conditions and substrate temperature feedback
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively corrects temperature changes for each process, preventing surface shape transcription and abnormal gas leakage, ensuring consistent process outcomes.
Implementation Method 1
a flow path through which the temperature-controlling medium having an adjusted temperature flows is formed in the stage
Implementation Method 2
a discharge port via which heat transfer gas is discharged toward the placement surface
Data Source
AI summary
A system acquires a temperature TB of a temperature-controlling medium before a temperature change during execution of a plurality of processes n (n is identifier of process and is natural number that is greater than one) in each of which heat is input to a substrate placed on a placement surface of a stage, wherein the placement surface on which the substrate is placed is formed on the stage, a flow path through which the temperature-controlling medium having an adjusted temperature flows is formed in the stage, and a discharge port via which heat transfer gas is discharged toward the placement surface is formed in the stage; and for each of the processes n, a pressure Pn of heat transfer gas supplied to the discharge port and a temperature TWn of the substrate. The system also adjusts a pressure of heat transfer gas so as to control temperature of substrate.