Substrate Stage Gas Flow Segmentation for Sharp Temperature Gradients
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Solution Overview
Problem
Existing substrate processing technologies face challenges in accurately controlling temperature distributions across substrates, particularly in creating steep temperature gradients between the central and peripheral regions, which affects process characteristics such as etching rates.
Innovation Solution
A substrate stage design featuring an annular conductance band that divides the mounting surface into outer and inner regions, with distinct pressure control systems and diffusion portions to manage heat transfer gas flow, allowing for precise temperature control by creating significant pressure differences between these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single uniform pressure control system is used across the substrate mounting surface, then the structure is simple, but the temperature distribution control precision is insufficient
Solution Approach 1:
The substrate mounting surface is divided into multiple regions (central region and peripheral region) with separate pressure control systems. Each region has its own exhaust ports and pressure control mechanisms, allowing independent pressure adjustment to achieve precise temperature distribution control across different areas of the substrate.
Solution Approach 2:
Different regions of the substrate mounting surface are assigned different pressure characteristics. The central region and peripheral region have different exhaust port configurations and pressure control parameters, creating localized pressure zones that correspond to desired temperature profiles for different substrate areas.
2Temperature
If heat transfer gas flows uniformly across the entire substrate area, then the gas flow system is simple, but the temperature gradient control between central and peripheral regions is insufficient
Solution Approach 1:
The gas flow path is segmented into multiple independent channels corresponding to different substrate regions. Separate gas supply ports and flow control mechanisms are provided for the central region and peripheral region, enabling independent flow rate adjustment to create controlled temperature gradients across the substrate.
Solution Approach 2:
Different gas flow rates and temperatures are supplied to different regions of the substrate. The central region receives gas with different characteristics than the peripheral region, creating localized thermal environments that enable precise temperature gradient control for process optimization.
3Measurement precision
If the exhaust ports are uniformly distributed across the mounting surface, then the structural design is simple, but the pressure distribution uniformity and temperature control precision are insufficient
Solution Approach 1:
The exhaust port distribution is segmented into different patterns for different regions. The central region has a different exhaust port configuration compared to the peripheral region, with varying numbers, positions, and sizes of ports optimized for each region's pressure control requirements, enabling precise pressure distribution across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables sharp temperature distribution control between the outer and inner regions, enhancing the accuracy of substrate temperature management and expanding the range of controllable process characteristics, thereby improving etching efficiency and precision.
Implementation Method 1
an outer flow path provided in the base portion and in communication with the outer region, and configured to allow a heat transfer gas supplied to a space between the substrate and the mounting surface to flow through the outer flow path; an inner flow path provided in the base portion and in communication with the inner region, and configured to allow the heat transfer gas to flow through the inner flow path
Implementation Method 2
an annular diffusion portion provided in the base portion and configured to diffuse the heat transfer gas along a circumferential direction of the partition wall
Implementation Method 3
allowing for precise temperature control by creating significant pressure differences between these regions
Data Source
AI summary
A substrate stage includes: a base portion having a mounting surface; an annular support configured to support a substrate; an annular partition wall configured to divide the mounting surface into an outer region and an inner region in a radial direction of the substrate; a plurality of protrusions provided on the mounting surface and configured to support the substrate with a gap left between an upper end surface of the partition wall and the substrate; an outer flow path in communication with the outer region, and configured to allow a heat transfer gas supplied to a space between the substrate and the mounting surface to flow therethrough; an inner flow path in communication with the inner region, and configured to allow the heat transfer gas to flow therethrough; and an annular diffusion portion configured to diffuse the heat transfer gas along a circumferential direction of the partition wall.