Substrate Stage Groove Suction for Stable Wafer Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges in stably and accurately mounting substrates on stages due to insufficient suction force, leading to potential substrate slipping during film deposition processes, especially when only one through-hole is used for suction.
Innovation Solution
Incorporating a groove on the stage's mounting surface that communicates with the through-hole, allowing the suction force to be applied from the through-hole to the groove, which extends towards the center of the stage, thereby distributing the suction force more evenly and increasing its strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only one through-hole is used for suction, then the device complexity is reduced, but the suction force is insufficient leading to substrate slipping
Solution Approach 1:
The single through-hole suction structure is segmented into multiple suction pathways by adding grooves that divide the suction area into multiple regions. This segmentation allows the suction force to be distributed across multiple zones while still using a single through-hole, thereby increasing mounting reliability without significantly increasing device complexity.
Solution Approach 2:
The suction structure is extended from a single point (through-hole) to a two-dimensional area by adding grooves that create suction zones across the substrate mounting surface. This dimensional expansion increases the effective suction area and improves substrate holding stability without requiring additional through-holes.
2Device complexity
If suction force is applied through a single through-hole, then the device complexity is reduced, but the suction force distribution is uneven
Solution Approach 1:
The single through-hole suction structure is segmented into multiple suction pathways by adding grooves that divide the suction area into multiple regions. This segmentation allows the suction force to be distributed across multiple zones while still using a single through-hole, thereby increasing mounting reliability without significantly increasing device complexity.
Solution Approach 2:
Different regions of the substrate mounting surface are provided with different suction characteristics through the groove pattern. The grooves create local suction zones that can be optimized for different areas, ensuring uniform overall suction force distribution while maintaining a simple single through-hole structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures stable and accurate mounting of substrates, preventing slipping and enabling satisfactory substrate processing by applying a stronger and more evenly distributed suction force across the mounting surface.
Implementation Method 1
a gas suctioning section configured to apply a suction force to the substrate via the through-hole when the lift pin is being lowered
Data Source
AI summary
A substrate processing apparatus includes a vacuum chamber, a rotary table rotatably provided in the vacuum chamber, a stage having a mounting surface on which a substrate is mounted at a position spaced apart from a rotation center of the rotary table, a lift pin configured to be displaced relative to the stage through a through-hole of the stage to raise and lower the substrate, and a gas suctioning section configured to apply a suction force to the substrate via the through-hole when the lift pin is being lowered. The stage includes a groove on the mounting surface, the groove communicating with the through-hole and extending from the through-hole toward a center of the stage.