Substrate Stage Temperature Control Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses in semiconductor manufacturing struggle to independently control the temperatures of the central and peripheral portions of a substrate, leading to non-uniform surface temperature management and complex piping arrangements due to the mutual influence of coolant flow paths.
Innovation Solution
A substrate processing apparatus with independently formed central and peripheral temperature control flow paths, each connected to separate temperature control medium sources and outlet ports, allowing for precise control of coolant flow rates and temperatures without mutual influence, and simplifying the piping arrangement by using a substrate stage with non-contacting peripheral and central stage members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two coolant flow paths are arranged adjacent to each other within one substrate stage, then the peripheral and central portions of the substrate can be cooled, but the temperatures of the two coolant flow paths affect each other, making it impossible to independently control the temperatures of the central and peripheral portions of the substrate
Solution Approach 1:
The substrate stage is divided into a peripheral stage portion and a central stage portion that are physically separated and not in contact with each other. Each portion has its own independent coolant flow path, allowing independent temperature control without thermal interference between the paths.
Solution Approach 2:
A support base serves as an intermediary structure that supports both the peripheral stage portion and the central stage portion separately. This intermediary structure allows the two stage portions to be positioned independently without direct contact, preventing thermal influence between them while maintaining structural stability.
2Device complexity
If the substrate stage is formed integrally, then the structure is simplified, but the temperatures of the two coolant flow paths affect each other and the temperatures of the central portion and peripheral portion of the substrate cannot be independently controlled
Solution Approach 1:
The substrate stage is segmented into distinct peripheral and central stage portions that are not in contact with each other. This segmentation allows independent temperature control of each portion while maintaining a relatively simple overall structure supported by a common support base.
3Temperature
If two independent coolant flow paths are provided, then the temperatures of central and peripheral portions can be controlled separately, but the number of pipes required increases and the piping arrangement becomes complicated
Solution Approach 1:
By segmenting the substrate stage into non-contacting peripheral and central portions, each with separate coolant flow paths, the system achieves independent temperature control. The piping complexity is managed by having each portion connect to the vacuum processing space independently, allowing separate coolant supply and discharge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and independent temperature control of substrate surfaces, ensuring uniformity and simplifying the piping setup, thereby improving processing uniformity and reducing complexity in semiconductor manufacturing.
Implementation Method 1
cooling the surface of the substrate mounted on the substrate stage with radiant heat radiating from the substrate stage
Implementation Method 2
allowing a coolant to flow through the flow path and cooling the surface of the substrate
Data Source
AI summary
A substrate processing apparatus includes a substrate stage for mounting two or more substrates thereon. The substrate stage includes substrate stage units. Each of the substrate stage units includes a central temperature control flow path for controlling the temperature of a central portion of each of the substrates and a peripheral temperature control flow path for controlling the temperature of a peripheral portion of each of the substrates. The central temperature control flow path and the peripheral temperature control flow path are formed independently of each other. The substrate stage includes one temperature control medium inlet port for introducing therethrough a temperature control medium into the peripheral temperature control flow path and temperature control medium outlet ports for discharging therethrough the temperature control medium from the peripheral temperature control flow path. The number of the temperature control medium outlet ports corresponds to the number of substrates.