Substrate Standby Area in Series-Coupled Mounting Apparatus
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Solution Overview
Problem
Existing electronic component mounting systems face inefficiencies due to the need for large conveyor sizes to accommodate maximum substrate dimensions, leading to increased facility size and wasted time during substrate transfer.
Innovation Solution
A compact electronic component mounting system design where carry-in and carry-out conveyors of adjacent apparatuses form a substrate standby area, allowing for temporary placement of substrates and reducing transfer time, while maintaining a compact facility by utilizing a series-coupled configuration of electronic component mounting apparatuses with belt-conveyor work and transfer mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If carry-in conveyor and carry-out conveyor are provided within each electronic component mounting apparatus, then substrate transfer efficiency is improved, but the size of the mounting apparatus increases
Solution Approach 1:
The patent merges the carry-in conveyor of one mounting apparatus with the carry-out conveyor of the upstream mounting apparatus to form a shared substrate standby area. This consolidation eliminates redundant conveyor structures, reduces the overall facility size, and maintains efficient substrate transfer by allowing substrates to be temporarily held in the shared area between apparatuses.
2Adaptability or versatility
If conveyor size is set to accommodate maximum substrate dimension, then all substrate sizes can be handled, but the conveyor dimension and facility size increase
Solution Approach 1:
The patent implements adjustable conveyor mechanisms that can dynamically adapt their effective length and configuration based on the specific substrate size being processed. The conveyor systems in the substrate standby area can be adjusted to match the actual substrate dimensions rather than being fixed at maximum size, allowing versatile substrate handling while maintaining a compact facility footprint.
Data Source
AI summary
In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.