Substrate Storage Container Retainer Design

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Solution Overview

Problem

The existing substrate storage containers for large silicon wafers face issues with standardized cover opening/closing devices, risk of wafer damage during transportation, particle generation, and mispositioning, especially with the FOSB type containers, which require modifications and are prone to sealing gasket mispositioning or deformation.

Innovation Solution

A substrate storage container design featuring an open-front box-type casing with a cover, elastic retainer pieces, and a sealing gasket that can deform, providing a substrate retaining force within a specific range to prevent damage and mispositioning, allowing for the use of standardized cover opening/closing devices without modifications, and ensuring secure sealing and reduced particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If an open-front box-type container is used for large diameter silicon wafers, then automation is enabled and substrate feeding efficiency is improved, but the cover opening/closing device cannot be standardized across different container types

Engineering Contradiction:
Improvesubstrate feeding efficiencyVSAvoiddevice standardization
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent designs the cover opening/closing mechanism with universal features that can be applied to both FOUP and FOSB container types. The latch mechanism, cover structure, and opening/closing motion are standardized to allow a single automated device to handle multiple container types, thereby achieving device standardization while maintaining automation capabilities for high-efficiency substrate feeding.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If silicon wafers are subjected to greater than anticipated shock during transportation, then the risk of wafer damage increases, but adding more protective structures increases device complexity

Engineering Contradiction:
Improvewafer protection during transportationVSAvoidprotective structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent incorporates cushioning elements and shock-absorbing structures within the container design that are activated before extreme shock events occur. These include compliant mounting structures for the wafers, cushioning material in critical areas, and a container structure designed to distribute shock loads, thereby protecting wafers during transportation without requiring complex active protection systems.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If the substrate retaining force of elastic pieces is increased to prevent wafer damage, then the risk of gasket mispositioning or excessive deformation increases

Engineering Contradiction:
Improvesubstrate retention securityVSAvoidsealing gasket positioning accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies different local qualities to different parts of the retainer structure. The elastic pieces have localized high compliance and cushioning properties to secure wafers without excessive force, while the sealing gasket area maintains higher rigidity and dimensional stability to prevent mispositioning. This spatial differentiation of mechanical properties allows the structure to simultaneously provide secure substrate retention and maintain sealing precision.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents substrate damage during transportation, allows for standardized cover operation across types, and maintains precise positioning and sealing performance, reducing the risk of particle generation and gasket deformation.

Implementation Method 1

a sealing gasket capable of elastic deformation provided between the container casing and the cover

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

a plurality of elastic pieces provided in elastically deformable fashion on the supporting body; the substrate retaining force of each of the elastic pieces when the maximum number of the silicon wafers is stored in the container casing is in a range of 1.3 to 4.5 N

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS7344031B2Substrate storage container
Publication Date: 2008.03.18 SHIN ETSU POLYMER CO LTD
  • US7344031B2 patent drawing
  • US7344031B2 patent drawing
  • US7344031B2 patent drawing

AI summary

A substrate storage container comprises: a container casing having an aperture through which a plurality of substrates are placed in or taken out; a cover adapted to fit into the aperture of the container casing; a sealing gasket capable of elastic deformation provided between the container casing and the cover; and a retainer, mounted on the cover, capable of retaining the periphery of the substrates. The retainer has: a supporting body mounted on the inside face of the cover; a plurality of elastic pieces provided in elastically deformable fashion on the supporting body; and a block provided on each of the elastic pieces, the block retaining the periphery of one of the substrates. A relation 10.8×w<y<34.3×w is satisfied when a substrate retaining force of each of the elastic pieces is y [unit: N] and a weight per the substrate is w [unit: kg].