Substrate Stress Signal Amplifier Using Non-Parallel Current Mirrors

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Very Large Scale Integration (VLSI) chips are prone to mechanical and circuit failures due to stresses from packaging, thermal loading, and proximity materials, which affect transistor carrier mobility and lead to increased failure rates.

Innovation Solution

A stress-measuring circuit using two non-parallel current mirrors with transistors oriented to cancel direction-dependent mobility changes, allowing for precise determination of stress through current differences, enhancing sensitivity and resolution for stress detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If transistors are oriented to cancel direction-dependent mobility changes, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvestress detection precisionVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The circuit is divided into two separate current mirrors with transistors oriented in different directions. Each current mirror measures stress components along different axes, and the results are combined to achieve complete stress characterization. This segmentation allows precise stress measurement while maintaining manageable circuit complexity through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs asymmetric transistor orientations within the current mirrors, where transistors are deliberately positioned at different angles (e.g., 0 degrees and 45 degrees) to capture direction-dependent mobility changes. This asymmetric arrangement enables the circuit to detect stress components along multiple directions, improving measurement precision without requiring completely symmetric complex structures.

Inventive Principle:
Principle #4Asymmetry

2Measurement precision

If stress measurement sensitivity is increased through non-parallel current mirrors, then measurement precision is improved, but ease of manufacture decreases

Engineering Contradiction:
Improvestress measurement sensitivityVSAvoidcircuit fabrication ease
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent changes the orientation parameter of transistors within standard manufacturing capabilities. By selecting specific angles (such as 0 degrees and 45 degrees) that can be achieved through conventional photolithography and alignment processes, the design achieves high measurement sensitivity while remaining compatible with standard CMOS fabrication techniques. This parameter optimization balances manufacturing ease with measurement precision.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The circuit effectively amplifies stress-dependent signals, providing improved mechanical and circuit reliability by accurately measuring and responding to stress levels, reducing the likelihood of failure.

Implementation Method 1

Stress on a silicon-based transistor affects the transistor's carrier mobility (μ). Stresses as large as 108 Pa may produce mobility changes (Δμ/μ) on the order of 10%.

Methodology Applied
Scientific EffectStress-dependent carrier mobility change:

Data Source

PatentUS7521993B1Substrate stress signal amplifier
Publication Date: 2009.04.21 ORACLE AMERICAN INC
  • US7521993B1 patent drawing
  • US7521993B1 patent drawing
  • US7521993B1 patent drawing

AI summary

A computer system includes a substrate on which a first current mirror and a second current mirror are disposed. When a stress is present, a behavior, e.g., carrier mobility, of at least one of the devices in each of the first current mirror and the second current mirror is dependent on a direction in which that device is disposed on the substrate. Further, one of the devices in the first current mirror is disposed in a non-parallel orientation with respect to one of the devices in the second current mirror.