Substrate Stress Uniformity via Overlay Error Divergence
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Solution Overview
Problem
Conventional methods face challenges in translating in-plane distortion measurements into actionable insights for corrective actions in substrate manufacturing, as these measurements are complex and difficult to interpret, leading to inefficiencies and sub-optimal substrate properties.
Innovation Solution
The method involves generating a stress map from overlay error data by calculating the divergence of in-plane distortion, which is correlated to substrate stress, allowing for physically meaningful data that informs corrective actions to adjust manufacturing parameters and improve substrate properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If in-plane distortion measurements are used directly for corrective actions, then measurement data is obtained, but the data is complex and difficult to interpret leading to sub-optimal substrate properties
Solution Approach 1:
The patent introduces stress uniformity data as an intermediary that translates complex in-plane distortion measurements into physically meaningful information. The overlay error measurements serve as input to a model that generates stress uniformity maps, which are easier to interpret and directly relate to substrate properties. This intermediary transformation resolves the contradiction by maintaining measurement precision while dramatically improving ease of operation and data interpretability.
Solution Approach 2:
The patent transforms the measurement parameters from raw in-plane distortion vectors to stress uniformity metrics through mathematical modeling. By changing the parameter representation from complex spatial distortion fields to simplified stress uniformity values, the system maintains the precision of original measurements while making the data much easier to interpret and act upon for corrective manufacturing adjustments.
2Loss of information
If complex in-plane distortion data is used for corrective actions, then measurement information is captured, but corrective actions become less effective due to difficulty in translation to actionable insights
Solution Approach 1:
The stress uniformity model acts as an intermediary that preserves all essential information from in-plane distortion measurements while presenting it in a form that directly guides corrective actions. The model maintains the relationship between measurements and substrate properties, enabling effective manufacturing precision control without losing critical measurement information in the transformation process.
Solution Approach 2:
By transforming parameters from complex distortion vectors to stress uniformity metrics, the patent improves manufacturing precision. The transformed parameters maintain full information content while being directly actionable for controlling substrate properties, thereby resolving the contradiction between information retention and manufacturing precision.
3Measurement precision
If traditional substrate stress measurement methods are used, then direct stress data is obtained, but the measurement processes are time-consuming and reduce throughput
Solution Approach 1:
The patent replaces direct mechanical/physical stress measurement methods with a computational modeling approach. Instead of using time-consuming physical measurement equipment to directly measure substrate stress, the system uses overlay error measurements combined with a stress model to calculate stress uniformity. This substitution maintains measurement precision while dramatically improving productivity by eliminating bottlenecks associated with direct stress measurement equipment and procedures.
Solution Approach 2:
The computational model serves as an intermediary that translates readily available overlay error data into substrate stress information without requiring time-consuming direct stress measurements. This intermediary approach preserves the precision needed for stress characterization while enabling high-throughput processing by using data already captured during normal manufacturing operations.
4Measurement precision
If direct physical measurement of substrate stress is performed, then accurate stress data is obtained, but the complexity and cost of measurement equipment increases
Solution Approach 1:
The patent substitutes complex direct stress measurement equipment with a computational modeling system. Instead of requiring sophisticated physical measurement devices to directly measure substrate stress, the system uses standard overlay error measurement equipment combined with a stress model. This substitution maintains measurement precision while dramatically reducing device complexity and associated costs.
Solution Approach 2:
The stress model acts as an intermediary that translates data from simple, inexpensive overlay error measurements into accurate substrate stress information. This intermediary approach eliminates the need for complex and expensive direct stress measurement equipment while maintaining the precision required for effective substrate property control.
Data Source
AI summary
A method includes obtaining, by a processing device, first data indicative of overlay error of a substrate. The method further includes generating second data indicative of first stress uniformity of the substrate based on the first data. The method further includes performing a corrective action based on the second data.