Substrate Structuring via Hydrophobic Masking Without Photolithography
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing photolithography-based methods for forming patterns on substrates in microelectronics are costly and time-consuming, particularly due to the complexity and duration of the resin stripping process.
Innovation Solution
A method involving bonding a handle substrate with raised elements to a substrate of interest with a thin film sensitive to an etchant, forming a hydrophobic layer on uncovered areas, and then etching the substrate using an aqueous etchant solution, thereby forming raised patterns without the need for photolithography.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography with resin is used to form patterns on substrate, then pattern formation can be achieved, but the process becomes time-consuming and costly due to complex resin stripping steps
Solution Approach 1:
The invention extracts and eliminates the resin stripping step from the photolithography process by using a different approach: bonding a handle substrate with raised elements to define patterns, then directly etching the substrate through openings where resin would traditionally be removed. This removes the time-consuming stripping operation while maintaining pattern formation capability.
Solution Approach 2:
Instead of using resin to protect areas and then removing it, the invention inverts the approach by using raised elements on a handle substrate to directly define the pattern areas that will be etched. The process goes from protection-then-removal to direct-definition-then-etching, eliminating the need for resin stripping.
2Manufacturing precision
If photolithography with resin is used to form patterns on substrate, then pattern formation can be achieved, but the process becomes costly due to resin, solvents, and cleaning solutions
Solution Approach 1:
The invention extracts and eliminates the expensive resin, solvents, and cleaning solutions from the process by replacing the photolithography approach with a direct bonding and etching method using a handle substrate with raised elements, significantly reducing material costs.
Solution Approach 2:
The handle substrate with raised elements serves as a reusable template that defines patterns without requiring expensive consumable resins and solvents. The raised elements are permanent features on the handle substrate that can be used repeatedly for multiple pattern formation operations.
3Manufacturing precision
If photolithography with resin is used to form patterns on substrate, then pattern formation can be achieved, but the resin stripping step becomes complex requiring aggressive cleaning agents
Solution Approach 1:
The invention inverts the traditional photolithography sequence by eliminating the resin application and stripping steps entirely. Instead of coating resin, exposing through a mask, and stripping, the method uses direct bonding of a handle substrate with raised elements followed by selective etching, simplifying the process flow.
Solution Approach 2:
The invention extracts and removes the complex resin stripping step from the process by using a handle substrate with raised elements that directly define the pattern areas, eliminating the need for aggressive cleaning agents and complex stripping procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the time and cost of pattern formation by eliminating the need for photolithography and resin stripping, while also allowing for the reuse of the handle substrate and efficient etching of sensitive materials.
Implementation Method 1
forming a hydrophobic layer on the first areas of the thin film, for example by placing into contact the assembly obtained at step a) with a solution comprising a hydrophobic compound
Implementation Method 2
Placing into contact the substrate of interest with an aqueous solution comprising the etchant, whereby the material sensitive to the etchant present in the second areas of the thin film is etched and raised patterns are formed
Data Source
AI summary
A method comprising the following steps: a) Bonding a handle substrate including raised elements to a substrate of interest including a support substrate covered with a thin film including a material sensitive to an etchant, whereby the thin film includes first areas not covered with the raised elements and second areas covered with said elements, b) Placing into contact the obtained assembly with a solution including a hydrophobic agent, to cover the first areas with a hydrophobic film, c) Separating the two substrates, d) Placing into contact the substrate of interest with a solution containing the etchant, whereby the material sensitive to the etchant present in the second areas is etched and raised patterns are formed.