Substrate Processing Apparatus Suction for Laser Cutting Contamination
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Solution Overview
Problem
Substrate contamination during processing due to fumes generated during laser cutting, which interferes with subsequent pixel formation and results in defective substrates, as contamination particles are adsorbed onto both surfaces of the substrate.
Innovation Solution
A substrate processing apparatus with a support frame, first and second stages, and a suction part, where the second stage surrounds the first stage, and integrated passages and opening parts allow for the suction of contamination particles generated from both surfaces into a single suction part, preventing adsorption onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed on the substrate, then the substrate is cut into desired shape, but contamination particles are generated and adsorbed onto the substrate surfaces
Solution Approach 1:
The patent extracts and removes contamination particles from the processing environment by introducing a suction part that actively draws out fumes and particles generated during laser cutting. The suction part includes a suction hole positioned to directly remove particles before they can adsorb onto the substrate surfaces, thereby separating the harmful byproducts from the processing zone.
Solution Approach 2:
The patent introduces air streams as an intermediary medium to control particle movement. By generating controlled air flows around the substrate, the system directs contamination particles toward the suction hole while maintaining a clean environment on the substrate surfaces. The air stream acts as a mediator that transports particles from the generation zone to the removal zone.
2Productivity
If contamination particles are adsorbed onto the substrate, then laser cutting can be performed, but subsequent pixel formation process is interfered with and substrates become defective
Solution Approach 1:
The patent applies preliminary action by removing contamination particles during the laser cutting process itself, rather than attempting to remove them afterward. The suction part is activated concurrently with laser cutting to prevent particle adsorption before it occurs, ensuring the substrate remains clean for subsequent pixel formation processes.
Solution Approach 2:
The system employs feedback through pressure sensors that detect pressure changes caused by particle generation during laser cutting. This feedback mechanism allows the suction part to dynamically adjust its operation to maintain optimal particle removal efficiency, ensuring continuous protection of substrate quality throughout the cutting process.
3Object-affected harmful factors
If a suction part is introduced to remove contamination particles, then substrate contamination is prevented, but the device complexity increases
Solution Approach 1:
The patent merges the suction function with the existing stage structure by integrating the suction part into the stage assembly. The suction hole is positioned on the stage or support frame, combining the substrate holding function with the particle removal function into a single integrated structure, thereby reducing overall system complexity.
Solution Approach 2:
The stage structure serves multiple functions: it supports the substrate during laser cutting, generates controlled air streams for particle management, and houses the suction hole for particle removal. This multi-functionality reduces the need for separate dedicated components, simplifying the overall apparatus while maintaining effective contamination control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes contamination particles from both surfaces of the substrate, preventing contamination and ensuring successful subsequent processing steps by maintaining a differential pressure that facilitates efficient suction of particles.
Implementation Method 1
When the contamination particles are suctioned into the suction part, a pressure of a lower side of the substrate is less than that which exists on an upper side of the substrate at the first opening part
Implementation Method 2
A suction part is disposed on both the second stage and the support frame... Subsequent to the irradiation process, contamination particles are suctioned into the suction part
Data Source
AI summary
A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.