Substrate for Superconducting Thin-Film Strip Conductor

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Solution Overview

Problem

High-temperature superconducting thin-film strip conductors produced via chemical coating methods often result in untextured or weakly textured strontium titanate layers due to the presence of a chalcogenide superstructure, which is costly to remove using physical deposition methods, and chemical methods struggle to achieve comparable results to physical methods, especially for materials that grow unrotated on the substrate.

Innovation Solution

A biaxially textured metal substrate is used, with the removal of the superstructure followed by chemical generation of a buffer layer and superconducting coating, where the buffer layer is grown crystallographically unrotated relative to the substrate, and the substrate is polished to a surface roughness of less than 50 nm to enhance texture formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If physical deposition methods are used to deposit buffer layers, then uniform superstructure with high coverage is achieved, but production cost increases significantly

Engineering Contradiction:
Improveuniformity of superstructureVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces physical deposition methods (mechanical/vacuum-based) with chemical coating methods (solution-based), substituting a costly and complex physical process with a simpler, more cost-effective chemical process while maintaining the quality of superstructure formation

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition parameters by using chemical solution deposition instead of physical vapor deposition, altering the fundamental mechanism from physical to chemical while achieving comparable or superior results at lower cost

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If chemical coating methods are used to deposit buffer layers, then production cost decreases, but texture quality deteriorates for unrotated materials

Engineering Contradiction:
Improveproduction costVSAvoidtexture quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent optimizes chemical coating parameters including solution composition, deposition temperature, and processing conditions to achieve high texture quality with unrotated buffer layer materials, demonstrating that chemical methods can match physical methods when parameters are properly controlled

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent achieves results comparable to physical deposition methods using chemical coating, effectively copying the quality outcomes of expensive physical methods through a more economical chemical process

Inventive Principle:
Principle #26Copying

3Reliability

If chalcogenide superstructure is present on metal substrate, then epitaxial growth is encouraged for physical deposition, but texture formation is prevented for chemical coating of unrotated materials

Engineering Contradiction:
Improveepitaxial growthVSAvoidtexture formation
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent recognizes that different buffer layer materials have different requirements regarding the chalcogenide superstructure - rotated materials benefit from its presence while unrotated materials require its removal, and applies the appropriate treatment locally based on the specific material system

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent inverts the conventional approach by removing the chalcogenide superstructure before chemical coating when using unrotated buffer layer materials, whereas traditionally the superstructure is preserved for physical deposition methods

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process achieves highly-textured buffer layers regardless of the superstructure removal method or chemical coating process, resulting in improved texture and cost-effectiveness for high-temperature superconducting thin-film strip conductors.

Implementation Method 1

The textured metal substrate is coated with a buffer layer, which transfers the texture of the metal substrate to a superconducting layer generated subsequently on the buffer layer

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Implementation Method 2

The metal substrate, moreover, may be polished to a surface roughness of less than about 50 nm

Methodology Applied
Scientific EffectMechanical polishing: Abrasion

Implementation Method 3

An HTSL-CC may also be produced utilizing chemical coating methods (e.g., chemical solution deposition (CSD) and metal organic deposition (MOD))

Methodology Applied
Scientific EffectChemical solution deposition: Chemical Vapour Deposition

Data Source

PatentUS8513163B2Substrate for a superconducting thin-film strip conductor
Publication Date: 2013.08.20 AMERICAN SUPERCONDUCTOR CORP

AI summary

A high-temperature superconducting thin-film strip conductor (HTSL-CC) includes a metal substrate, a buffer layer chemically generated thereon and grown crystallographically unrotated in relation to the metal substrate, and a chemically generated superconducting coating thereon. The HTSL-CC possesses high texturing of the buffer layer since the metal substrate has a surface roughness RMS<50 nm, and since and the buffer layer is grown directly onto its surface, without an intermediate layer, crystallographically unrotated in relation to the crystalline structure of the metal substrate.