Substrate Support Gas Pressure Control to Prevent Arcing
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Solution Overview
Problem
Arcing occurs in substrate support devices due to changes in distance between electrodes and pressure caused by temperature fluctuations and refrigerant flow, leading to damage in substrates and process lines during semiconductor manufacturing.
Innovation Solution
A substrate support device with arc control gas flow paths and pressure control mechanisms to manage arc control gas flow and pressure, preventing arcing by controlling discharge voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If refrigerant flows through the substrate support device to cool the substrate, then cooling efficiency is improved, but temperature fluctuations cause expansion and contraction leading to arcing
Solution Approach 1:
The patent introduces arc control gas as an intermediary substance between the electrostatic-chuck plate and electrode plate. This gas layer acts as a mediator that prevents direct electrical discharge (arcing) while allowing the refrigerant cooling system to continue operating. The gas flow path and pressure control mechanism serve as intermediary systems that decouple the cooling function from the arcing problem.
Solution Approach 2:
The patent creates an inert gas environment in the flow path between the electrostatic-chuck plate and electrode plate by supplying arc control gas at controlled pressure. This inert atmosphere prevents electrical arcing by displacing air and other gases that could facilitate discharge, while maintaining the thermal conduction needed for cooling.
2Productivity
If high power and low frequency are used for substrate processing, then processing efficiency is improved, but arcing occurrence increases
Solution Approach 1:
The arc control gas serves as an intermediary that allows high power processing to proceed without arcing. The gas flow path and pressure control create a protective environment that enables the use of high power and low frequency processing conditions while preventing the harmful arcing effects.
3Adaptability or versatility
If distance between electrodes changes due to thermal expansion, then cooling adaptability is improved, but discharge voltage control becomes difficult leading to arcing
Solution Approach 1:
The patent controls the pressure parameter of the arc control gas to compensate for changes in electrode distance caused by thermal expansion. By adjusting gas pressure, the system maintains stable discharge voltage control despite physical dimensional changes in the substrate support device during cooling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents arcing on the electrostatic-chuck plate and other components by managing gas flow and pressure, ensuring stable substrate processing conditions.
Implementation Method 1
an electrostatic-chuck plate configured to allow a substrate to be seated thereon and attract and support the substrate using electrostatic force
Implementation Method 2
controlling discharge voltage by forming flow of arc control gas in an upper portion of a substrate support device and controlling the pressure of the arc control gas, thereby preventing the occurrence of arcing
Implementation Method 3
a cooling path formed therein to allow refrigerant for cooling of the substrate and the electrostatic-chuck plate to flow therethrough
Implementation Method 4
a pressure control valve disposed on the arc control gas line to control pressure of the arc control gas
Data Source
AI summary
Disclosed are a substrate support device and a method of preventing the occurrence of arcing. Discharge voltage is controlled by forming flow of arc control gas in an upper portion of the substrate support device and controlling the pressure of the arc control gas, thereby preventing the occurrence of arcing.