Substrate Support Assembly for Fragile Optical Devices
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Solution Overview
Problem
In the manufacture of optical devices, existing substrate support assemblies risk damaging devices with sub-micron critical dimensions by contacting them, and fragile substrates with thicknesses less than 1 mm are prone to deformation during processing.
Innovation Solution
The substrate support assemblies employ a design with projections and pockets that allow for vacuum or gas communication to secure the substrate without contacting the devices, using actuated mechanisms and gas flow controllers to maintain the substrate without deformation, and include edge rings with pixel support plates to accommodate varying device configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate support assembly contacts the devices on the substrate surface, then the substrate can be securely retained, but the devices with sub-micron critical dimensions may be damaged
Solution Approach 1:
The support assembly is segmented into multiple discrete support points (projections) rather than a continuous contact surface. Each projection independently supports the substrate at specific locations away from device regions, distributing retention forces and eliminating contact with delicate devices.
Solution Approach 2:
The patent introduces an intermediary support structure (projections with controlled geometry and positioning) that mediates between the need for substrate retention and the need to protect devices. The projections act as intermediate contact points that transfer support forces without reaching the device areas.
2Device complexity
If the substrate support assembly uses traditional contact-based support, then simple retention is achieved, but fragile substrates with thickness less than 1 mm undergo deformation
Solution Approach 1:
The support assembly implements local quality by providing support only at specific discrete locations (projections) rather than uniform contact across the entire substrate. This localized support strategy concentrates forces at safe points while leaving device regions and fragile areas unsupported, preventing deformation.
Solution Approach 2:
The support system incorporates adjustability and adaptability in its projection configuration, allowing the support points to be positioned and configured dynamically to match different substrate geometries and device layouts, optimizing support effectiveness while minimizing deformation risk.
3Reliability
If the substrate support assembly uses projections and pockets with vacuum communication, then the substrate is retained without contacting devices, but the system complexity increases
Solution Approach 1:
The patent employs pneumatic principles by integrating vacuum communication through pocket conduits connected to vacuum sources. This pneumatic field approach creates retention forces without mechanical contact, using pressure differentials to hold the substrate securely while protecting devices from direct contact forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively retains substrates with optical devices without contacting or deforming them, enabling precise processing of fragile materials with sub-micron features, such as waveguide combiners, across various manufacturing systems like CVD and nano-imprint lithography.
Implementation Method 1
a pocket conduit operable to be in fluid communication with a vacuum source via a vacuum flow controller
Implementation Method 2
a pocket conduit operable to be in fluid communication with a gas source via a gas flow controller
Data Source
AI summary
Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.