Semiconductor Package Substrate Support Structures for BGA Cavity Warpage

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Solution Overview

Problem

Semiconductor package substrates experience warping due to thermal and physical loads, which can lead to electrical connection failures.

Innovation Solution

Incorporating support structures within central and peripheral cavity regions of the semiconductor package substrates, these structures bridge between the package substrate and the board, providing mechanical reinforcement and reducing warpage tendencies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If support structures are added to the semiconductor package substrate, then warpage resistance and structural stability are improved, but device complexity and manufacturing steps increase

Engineering Contradiction:

Improvesubstrate stabilityVSAvoidpackage structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The support structure is divided into multiple discrete elements (first support elements in ball grid array regions, second support elements in non-ball grid array regions) rather than a single continuous structure. This segmentation allows targeted reinforcement where needed while maintaining manufacturing feasibility and reducing overall complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different support elements are placed in different regions of the substrate based on local requirements - ball grid array regions receive first support elements while non-ball grid array regions receive second support elements. This local differentiation optimizes warpage resistance without uniformly increasing complexity across the entire package

Inventive Principle:

Principle #3Local quality

2Productivity

If support structures are incorporated into the package substrate, then throughput yield and reliability are improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvethroughput yieldVSAvoidassembly process simplicity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The support structures are pre-formed and positioned on the substrate before final assembly operations. This preliminary placement ensures proper structural reinforcement is in place during critical assembly stages, improving throughput yield without requiring complex real-time adjustments during manufacturing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The support structures act as intermediary elements between the substrate and other package components. They provide a stable foundation that facilitates subsequent assembly operations, improving overall manufacturing ease despite the additional structural element

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10636749B2Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same

Publication Date: 2020.04.28 SK HYNIX NAND PRODUCT SOLUTIONS CORP

AI summary

A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.