Substrate Support Carrier Bond Layer Protection
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Solution Overview
Problem
The erosion of the bond layer in substrate support pedestals due to process gases leads to contamination, reduced product yields, and temperature non-uniformities in semiconductor processing, as the gas flow passages allow gases to flow between the electrostatic chuck and the cooling base, causing erosion and altering heat transfer rates.
Innovation Solution
A substrate support pedestal design incorporating a porous plug within the gas flow passage and a sealing member to form radial and axial seals, preventing process gases from reaching the bond layer, thereby protecting it from erosion and maintaining uniform heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If gas flow passages are provided between the electrostatic chuck and cooling base, then heat transfer control is improved, but the bond layer is eroded by process gases
Solution Approach 1:
The gas flow passage is segmented into two distinct regions: a first portion that allows gas flow between the electrostatic chuck and substrate for heat transfer control, and a second portion that is sealed off from the bond layer. This segmentation enables the system to maintain temperature control functionality while preventing process gases from eroding the bond layer.
Solution Approach 2:
A seal member is introduced as an intermediary element between the gas flow passage and the bond layer. This seal member blocks the harmful gas flow path to the bond layer while allowing the gas flow passage to continue serving its heat transfer control function in the substrate processing chamber.
2Loss of energy
If gas flow passages allow process gases to reach the bond layer area, then cooling function is enhanced, but contamination increases and product yields decrease
Solution Approach 1:
The gas flow passage is divided into a first portion extending from the electrostatic chuck to the substrate for heat transfer, and a second portion that is sealed from the bond layer. This segmentation allows cooling gas to flow effectively between the electrostatic chuck and substrate while preventing process gases from contaminating the bond layer area.
Solution Approach 2:
A seal member is positioned to create a barrier between the gas flow passage and the bond layer interface. This intermediary seal prevents process gases from reaching the bond layer, thereby eliminating contamination and maintaining high product yields while preserving the cooling function.
3Device complexity
If the bond layer is eroded, then device complexity remains unchanged, but temperature uniformity deteriorates and process drift occurs
Solution Approach 1:
A seal member is installed in advance at the interface between the electrostatic chuck and cooling base to prevent bond layer erosion before it can occur. This preliminary protective action maintains the integrity of the bond layer, ensuring stable heat transfer and consistent temperature uniformity throughout the substrate processing operation.
Solution Approach 2:
The seal member acts as a protective intermediary that prevents direct contact between process gases and the bond layer. By blocking the erosion pathway, the seal member maintains the thermal interface stability between the electrostatic chuck and cooling base, thereby preserving temperature uniformity and preventing process drift.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents bond layer erosion, reduces contamination, and maintains consistent substrate temperature by restricting gas flow, enhancing the longevity and performance of the substrate support pedestal.
Implementation Method 1
The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage
Implementation Method 2
The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck
Implementation Method 3
An electrostatic chuck generally includes one or more embedded electrodes which are driven to an electrical potential to hold a substrate against the electrostatic chuck during processing
Implementation Method 4
The cooling base typically includes one or more cooling channels and aids in controlling the temperature of the substrate during processing
Implementation Method 5
The gas fills the area between the electrostatic chuck and the substrate, enhancing the heat transfer rate between the substrate and the substrate support
Data Source
AI summary
A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.