Substrate Support Cleaning Control for Film Buildup in Process Chambers
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Solution Overview
Problem
Existing substrate processing apparatuses face inefficiencies in cleaning accumulated films from both the process vessel and substrate retainers when multiple substrate supports are used for a single process vessel.
Innovation Solution
A substrate processing apparatus equipped with a controller that monitors film thickness values and allocates cleaning times based on predefined thresholds, allowing for efficient cleaning of both the process vessel and substrate supports by loading and unloading them individually according to their specific cleaning times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning process is performed for both the process vessel and substrate retainer, then accumulated films are removed, but the cleaning time becomes excessive when multiple substrate supports are used
Solution Approach 1:
The cleaning process is segmented by dividing substrate supports into multiple groups based on their film thickness values. The controller performs cleaning for only one group at a time, rather than cleaning all substrate supports simultaneously or individually. This segmentation reduces the total cleaning time while ensuring that each group receives appropriate cleaning attention based on its specific film accumulation level.
Solution Approach 2:
The system changes the parameter of cleaning timing by determining cleaning intervals based on film thickness values. Instead of cleaning all substrate supports at fixed intervals or simultaneously, the controller adjusts the cleaning schedule dynamically according to the measured film thickness of each substrate support, optimizing the cleaning process to occur only when and where needed.
2Reliability
If cleaning is performed frequently to remove accumulated films, then film removal effectiveness is improved, but productivity decreases due to increased cleaning time
Solution Approach 1:
The system implements feedback control by measuring the film thickness values of substrate supports and using this information to determine when cleaning is required. The controller monitors the accumulation state and triggers cleaning operations based on actual film thickness data, ensuring cleaning is performed effectively only when necessary, thereby maintaining productivity while ensuring film removal effectiveness.
Solution Approach 2:
Instead of cleaning all substrate supports to the same extent or frequency, the system applies partial cleaning action based on individual film thickness levels. Substrate supports with lower film thickness values may skip cleaning or receive reduced cleaning time, while only those exceeding threshold values undergo full cleaning. This partial action approach maintains effectiveness for critical components while reducing overall cleaning time and preserving productivity.
Data Source
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AI summary
Provided is a technology comprising: a plurality of substrate support tools that can support at least one substrate; a processing container into which the plurality of substrate support tools are individually carried and in which the substrate supported by the substrate support tools is processed; a storage unit that stores cumulative values of film thicknesses of the processing container and each of the substrate support tools; and a control unit configured to be able to control execution of a cleaning process on the processing container and the substrate support tools, by allocating a predefined cleaning time for the processing container for each of the substrate support tools on the basis of the cumulative values for the substrate support tools when the cumulative value for the processing container becomes equal to or larger than a predefined threshold value, and by inserting/pulling out the substrate support tools into/from the processing container in accordance with the allocated cleaning time for said each of the substrate support tools.