Substrate Support Cleaning Control by Film Thickness Threshold
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Solution Overview
Problem
Existing substrate processing apparatuses face inefficiencies in removing accumulated films from processing containers and substrate holders, leading to potential stress and particle generation due to thick film deposition.
Innovation Solution
A substrate processing apparatus with a controller that monitors film thickness and allocates cleaning times based on cumulative values, using a gas supplier to remove deposited films from both the processing container and substrate supports when the threshold is reached, optimizing cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning is performed on all substrate supports and processing container regardless of film accumulation, then cleaning thoroughness is improved, but cleaning time and operational efficiency deteriorate
Solution Approach 1:
The system changes the cleaning parameter (cleaning time allocation) based on the film thickness parameter. By monitoring cumulative film thickness on each substrate support and the processing container, the controller dynamically adjusts cleaning time allocation, allocating more time to components with thicker film accumulation and less time to those with thinner accumulation, thus resolving the contradiction between thoroughness and efficiency
Solution Approach 2:
The system implements feedback by continuously monitoring film thickness on substrate supports and the processing container using sensors, and using this information to control the cleaning process. The controller receives film thickness data and automatically adjusts cleaning time allocation accordingly, ensuring that cleaning is performed thoroughly where needed while maintaining overall efficiency
2Reliability
If cleaning is performed frequently to remove accumulated film, then film removal effectiveness is improved, but operational time and productivity deteriorate
Solution Approach 1:
The system performs preliminary monitoring of film thickness accumulation on substrate supports and the processing container during normal operation. By tracking cumulative film thickness in real-time, the system prepares for cleaning by identifying which components need cleaning and when, allowing for optimized scheduling that minimizes operational time loss while ensuring effective film removal when thresholds are reached
3Ease of operation
If uniform cleaning time is allocated to all substrate supports, then operational simplicity is improved, but cleaning precision and uniformity deteriorate
Solution Approach 1:
The system applies local quality by allocating different cleaning times to different substrate supports based on their individual film thickness characteristics. Each substrate support receives a customized cleaning time allocation proportional to its cumulative film thickness, ensuring that each component is cleaned appropriately for its specific condition rather than applying a uniform approach, thus achieving cleaning uniformity while maintaining operational simplicity through automated control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces cleaning time and ensures uniform residual film thickness post-cleaning, maintaining film thickness information, and allows for adaptable threshold settings, enhancing operational efficiency and reducing particle generation.
Implementation Method 1
a gas supplier configured to supply a film forming gas for depositing a film
Implementation Method 2
a gas supplier configured to supply a film forming gas for depositing a film and a cleaning gas removing the deposited film
Data Source
AI summary
A technique including: a plurality of substrate supports for supporting at least one substrate; a processing container in which the supports and the substrate are processed; a gas supplier for supplying a film forming gas for depositing a film and a cleaning gas removing the deposited film into the processing container; a memory that stores the thickness of the deposited film; and a controller for controlling the cleaning process of the processing container and the two or more of the plurality of substrate supports, wherein the cleaning process is performed where value of the processing container is greater than or equal to a threshold value and, wherein the cleaning process including: allocating a cleaning time for each of the plurality of substrate supports; taking the substrate supports into the processing container; supplying the cleaning gas to remove the deposited film; and, taking the substrate supports from the processing container.