Substrate Support Plate Protrusions for Faster Cooling Contact
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Solution Overview
Problem
The cooling efficiency of semiconductor substrates is reduced due to the air gap created by support pins in conventional cooling units, which impede effective heat transfer.
Innovation Solution
A support unit with protrusions on the support plate that reduce the air gap between the substrate and the plate, enhancing heat transfer by providing a closer contact surface while minimizing the risk of substrate damage from excessive pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If support pins are used to support the substrate on the cooling plate, then the substrate is prevented from direct contact with the cooling plate, but an air gap is formed that reduces cooling efficiency
Solution Approach 1:
The support structure is segmented into multiple components: support pins for substrate support, a support plate for structural framework, and additional protrusions for gap reduction. This segmentation allows each component to fulfill its specific function while collectively resolving the contradiction between support stability and cooling efficiency.
Solution Approach 2:
Different regions of the support structure have different properties: support pins provide localized support points, while additional protrusions are strategically positioned to locally reduce the air gap in critical areas. This local quality approach allows the structure to maintain support function while improving heat transfer in specific regions where it matters most.
2Temperature
If the protrusion height is increased to reduce the air gap, then cooling efficiency is improved, but the risk of substrate damage from excessive pressure increases
Solution Approach 1:
Instead of uniformly reducing the air gap across the entire substrate surface, the invention applies partial action by positioning additional protrusions only in specific regions. This partial approach improves cooling efficiency in critical areas while avoiding excessive pressure application that could damage the substrate, thus resolving the contradiction between cooling performance and substrate safety.
Solution Approach 2:
The invention changes the geometric parameters of the support structure by adding protrusions with specific height and positioning. The protrusion height is optimized to reduce the air gap sufficiently for improved heat transfer while remaining below the threshold that would cause substrate damage. This parameter optimization resolves the contradiction between cooling efficiency and substrate protection.
3Strength
If support pins are positioned to avoid squeeze effect on the substrate, then substrate integrity is maintained, but cooling efficiency is reduced due to larger air gap
Solution Approach 1:
The invention merges the support function and the gap-reduction function into a single integrated structure. The additional protrusions are combined with the support pins to form a unified support system that simultaneously provides mechanical support and reduces the air gap. This merging allows both substrate integrity and cooling efficiency to be achieved without compromising either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support unit increases cooling performance by reducing the air gap and preventing substrate damage, thereby improving heat transfer efficiency without compromising the substrate's integrity.
Implementation Method 1
the cooling efficiency of the substrate is lowered by the air gap caused by the support pin 3
Data Source
AI summary
Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.