Substrate Support Coupling Structure for Cryogenic Leakage Control
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Solution Overview
Problem
The rapid temperature changes in the substrate support unit cause deformation of the metal plate, leading to a gap between the metal plate and the RF plate, resulting in fluid leakage during cryogenic processes in semiconductor manufacturing.
Innovation Solution
A substrate support unit with a dielectric plate, metal plate, and RF plate coupled by kinematic coupling units, including preload parts with magnets and yokes, to stabilize the metal plate and RF plate against deformation due to temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal plate is bolted to the RF plate using conventional coupling methods, then the structure is simple and easy to manufacture, but the rapid temperature changes cause deformation of the metal plate, leading to gap formation and fluid leakage
Solution Approach 1:
The coupling unit employs a dynamic coupling mechanism where the first member (attached to metal plate) and second member (attached to RF plate) can move relative to each other through kinematic coupling. This dynamic structure allows the coupling unit to adapt to thermal deformation of the metal plate while maintaining continuous contact and sealing between the metal plate and RF plate, preventing fluid leakage despite temperature changes
Solution Approach 2:
The coupling unit acts as an intermediary element between the metal plate and RF plate. Instead of directly bolting the two plates together, the coupling unit mediates the connection, absorbing thermal stresses and maintaining sealing through its kinematic coupling mechanism. This intermediary structure resolves the conflict between simple bolting and reliable sealing under thermal conditions
2Manufacturing precision
If the metal plate is rigidly fixed to prevent deformation, then alignment accuracy is improved, but the rapid temperature changes cause stress concentration and potential damage
Solution Approach 1:
The kinematic coupling between the first and second members provides a controlled degree of freedom that maintains alignment precision while allowing the structure to accommodate thermal expansion and contraction. The coupling unit moves dynamically to maintain contact without creating stress concentration points, preserving the structural strength of both the metal plate and RF plate during rapid temperature changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the gap between the metal plate and RF plate, preventing fluid leakage and improving the alignment and coupling accuracy, thereby enhancing the productivity of semiconductor manufacturing processes.
Implementation Method 1
each of the preload parts may include: a magnet provided in the metal plate; and a yoke provided in the RF plate and configured to generate magnetic force with the magnet
Data Source
AI summary
Proposed are a substrate support unit and a substrate processing apparatus including the same. The substrate support unit includes a dielectric plate on which a substrate is placed, a metal plate disposed under the dielectric plate, an RF plate disposed under the metal plate, and a plurality of coupling units configured to couple the metal plate and the RF plate to each other. The coupling units include a first member disposed on a lower surface of the metal plate, and a second member disposed in an upper surface of the RF plate and in contact with the first member. The first member and the second member are kinematically coupled to each other.