Substrate Support Member with Cut Region Vents for Contamination Control
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Solution Overview
Problem
Existing substrate treatment apparatuses face challenges in preventing contamination during thermal treatment processes, particularly in semiconductor manufacturing, where rapid thermal annealing processes can lead to contamination due to gas reactions and particle formation, affecting the efficiency and yield of semiconductor devices.
Innovation Solution
The apparatus includes a chamber with a support member that divides the space into upper and lower sections, using a base with cut regions and adjustment blocks to create vents for gas flow management, along with gas supply and exhaust ports to control gas currents and prevent contamination by efficiently moving gases between chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a support member divides the chamber into upper and lower spaces, then gas flow control is improved and contamination is prevented, but device complexity increases
Solution Approach 1:
The chamber is divided into upper and lower spaces by a support member with multiple cut regions, creating separate gas flow paths. This segmentation prevents contamination by isolating different gas zones while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The support member acts as an intermediary structure between the upper and lower chambers, providing controlled gas flow paths through cut regions. This mediator enables gas flow management and contamination prevention without requiring direct complex connections between chambers.
2Object-affected harmful factors
If cut regions and adjustment blocks are used to create vents, then gas flow management is improved and contamination is prevented, but manufacturing complexity increases
Solution Approach 1:
The base is divided into multiple cut regions with adjustment blocks that can be independently positioned. This segmentation allows flexible gas flow management through multiple vents while simplifying manufacturing by using standardized modular components that can be assembled rather than precision-machined as a single piece.
Solution Approach 2:
Adjustment blocks are provided that can be moved to different positions within cut regions to dynamically control vent openings. This dynamic adjustment capability allows flexible gas flow management without requiring complex fixed structures, simplifying manufacturing while maintaining contamination prevention.
3Object-affected harmful factors
If gas supply ports and exhaust ports are used to control gas currents, then contamination prevention is improved, but device complexity increases
Solution Approach 1:
Multiple gas supply ports and exhaust ports are distributed at different locations to create segmented gas flow control zones. This segmentation enables effective contamination prevention through controlled gas currents while maintaining manageable device complexity by using simple port structures rather than complex flow control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents contamination by ensuring a smooth flow of gases and efficient heat distribution, maintaining the cleanliness of the treatment chamber and enhancing the activation of dopants in semiconductor substrates, thereby improving the yield and characteristics of semiconductor devices.
Implementation Method 1
radiant heat energy may be emitted from a lamp so as to be transmitted to a wafer for a short time (millisecond level)
Implementation Method 2
The cut region may fluidly connect the upper space to the lower space
Data Source
AI summary
An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.