Substrate support device and substrate processing apparatus including the same
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Solution Overview
Problem
Existing substrate support devices in semiconductor manufacturing face challenges in achieving thermal insulation and cooling performance while minimizing their overall height, which affects the etching process.
Innovation Solution
A substrate support device design incorporating a seating plate, shaft, gap flange with gas inlet and outlet ports, and a cooling plate, along with cap members and sealing members to create thermal insulation gaps and enhance cooling efficiency, reducing heat transfer and device height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the height of the substrate support device is increased to block heat transfer, then thermal insulation performance is improved, but the overall device height increases which affects the substrate etching process
Solution Approach 1:
The patent introduces a thermal insulation gap that extends radially between the seating plate and the gap flange, transforming the thermal insulation approach from vertical thickness to radial depth. This allows effective heat blocking without increasing the vertical height of the substrate support device, directly resolving the contradiction between thermal insulation performance and device height.
2Reliability
If cooling gas circulation is enhanced to maintain temperature differential, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The gap flange structure serves multiple functions simultaneously: it provides structural support, creates the thermal insulation gap, and incorporates gas inlet/outlet ports for cooling. This multi-functionality achieves effective cooling without adding separate complex cooling components, resolving the contradiction between cooling performance and device complexity.
3Reliability
If sealing members are added to seal the thermal insulation gap, then thermal insulation performance is improved, but device complexity increases
Solution Approach 1:
The sealing member acts as an intermediary element that fills the gap between the seating plate and gap flange, creating an effective thermal barrier. This simple intermediate component achieves improved thermal insulation without requiring complex multi-layer insulation structures, resolving the contradiction between thermal insulation performance and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively ensures thermal insulation and cooling performance, reducing heat transfer and allowing for a lower overall height of the substrate support device, thereby improving the substrate etching process efficiency.
Implementation Method 1
a gap flange part coupled to the shaft part or the seating plate part to define a thermal insulation gap between the shaft part and the gap flange part and between the seating plate part and the gap flange part, the gap flange part including a gas inlet port and a gas outlet port so that cooling gas circulates in the thermal insulation gap
Implementation Method 2
a gap flange part coupled to the shaft part or the seating plate part to define a thermal insulation gap between the shaft part and the gap flange part and between the seating plate part and the gap flange part
Data Source
AI summary
A substrate support device according to one aspect of the present invention includes a seating plate part on which a substrate is seated, a shaft part coupled to a lower portion of the seating plate part to support the seating plate part, and a gap flange part coupled to the shaft part or the seating plate part to define a thermal insulation gap between the shaft part and the gap flange part and between the seating plate part and the gap flange part, the gap flange part including a gas inlet port and a gas outlet port so that cooling gas circulates in the thermal insulation gap.