Adjustable Substrate Support for Polishing Uniformity

Solution Overview

Problem

Existing substrate processing techniques, such as those described in PTL 1, face challenges in uniformly polishing substrates due to diameter tolerance variations, leading to inconsistent polishing results as the supporting members are not adequately positioned to accommodate the actual substrate diameter.

Innovation Solution

A substrate processing apparatus that includes a table, a pad holder, a swing mechanism, a supporting member, a measuring instrument, and a driving mechanism, where the measuring instrument determines the substrate's diameter and adjusts the supporting member's position to ensure uniform polishing, even with varying substrate diameters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the supporting member is disposed at a fixed position far from the substrate to avoid hindrance during loading, then the ease of operation is improved, but the manufacturing precision deteriorates due to inability to accommodate substrate diameter tolerance

Engineering Contradiction:

Improveease of substrate loadingVSAvoiduniformity of polishing

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The supporting member is designed to be movable in the radial direction of the substrate, transitioning from a static fixed position to a dynamic adjustable position. This allows the supporting member to adapt its position based on the actual substrate diameter, ensuring it supports the polishing pad at the appropriate location during polishing while not interfering with substrate loading operations.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The position of the supporting member is adjusted based on the measured substrate diameter. By changing the radial position parameter of the supporting member according to the substrate diameter tolerance, the system achieves both ease of operation (not interfering with loading) and manufacturing precision (maintaining uniform polishing).

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If the supporting member is disposed at a fixed position close to the substrate to maintain polishing uniformity, then the manufacturing precision is improved, but the ease of operation deteriorates due to potential interference during substrate loading

Engineering Contradiction:

Improveuniformity of polishingVSAvoidease of substrate loading

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The supporting member is designed to be movable in the radial direction of the substrate, transitioning from a static fixed position to a dynamic adjustable position. This allows the supporting member to adapt its position based on the actual substrate diameter, ensuring it supports the polishing pad at the appropriate location during polishing while not interfering with substrate loading operations.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system measures the substrate diameter before polishing and pre-adjusts the position of the supporting member accordingly. This preliminary action ensures that the supporting member is in the optimal position for uniform polishing while avoiding interference with substrate loading, as the adjustment is made in advance based on the measured substrate dimensions.

Inventive Principle:

Principle #10Preliminary action

3Device complexity

If the supporting member position is not adjusted according to substrate diameter tolerance, then the device complexity is reduced, but the manufacturing precision deteriorates due to pressure concentration on substrates with varying diameters

Engineering Contradiction:

Improvesimplicity of supporting member positioningVSAvoiduniformity of polishing

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The supporting member is designed to be movable in the radial direction of the substrate, transitioning from a static fixed position to a dynamic adjustable position. This allows the supporting member to adapt its position based on the actual substrate diameter, ensuring it supports the polishing pad at the appropriate location during polishing while not interfering with substrate loading operations.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system measures the substrate diameter and uses this feedback information to adjust the position of the supporting member. This closed-loop feedback mechanism ensures that the supporting member is positioned optimally for each substrate, preventing pressure concentration and maintaining uniform polishing across substrates with varying diameters.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS11735457B2Substrate processing apparatus and substrate processing method

Publication Date: 2023.08.22 EBARA CORP

AI summary

To improve uniformity in polishing of a polished surface of a substrate regardless of a tolerance of a diameter of the substrate. A substrate processing apparatus includes a table 100, a pad holder 226, a swing mechanism, a supporting member 300A, 300B, a measuring instrument 400, and a driving mechanism 320. The table 100 supports a substrate WF. The pad holder 226 holds a polishing pad 222. The polishing pad 222 polishes the substrate WF supported to the table 100. The swing mechanism swings the pad holder 226. The supporting member 300A, 300B supports the polishing pad 222 swung to outside the table 100 by the swing mechanism. The measuring instrument 400 is configured to measure a diameter of the substrate WF. The driving mechanism 320 adjusts a position of the supporting member 300A, 300B with respect to the substrate WF supported to the table 100 according to the diameter of the substrate WF measured by the measuring instrument 400.