Substrate Support Device Dual-Sided Cooling Plate
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Solution Overview
Problem
Conventional substrate support devices with built-in heating elements face challenges in uniform heating, leading to thermal strain and potential deformation, which can result in temperature variance on the wafer, affecting semiconductor device yield.
Innovation Solution
A substrate support device with a heater plate featuring a first cooling plate on the bottom and a second cooling plate on top, both with spiral flow paths that intersect and overlap to distribute coolant effectively, ensuring uniform heating and minimizing thermal strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional substrate support device with a single-sided cooling flow path is used, then the structure is simple, but the plate cannot be heated uniformly and may be deformed due to thermal strain
Solution Approach 1:
The cooling flow path is segmented into two separate flow paths: a first cooling flow path on the bottom surface of the plate and a second cooling flow path on the top surface of the plate. This segmentation allows independent coolant circulation on both surfaces, enabling uniform heat dissipation and preventing thermal deformation while maintaining structural simplicity.
Solution Approach 2:
The cooling system transitions from a two-dimensional single-sided flow path to a three-dimensional dual-sided configuration. By adding the vertical dimension with coolant flow on both the top and bottom surfaces of the plate, the system achieves superior thermal management and uniform heating without excessive complexity.
2Device complexity
If a conventional substrate support device with single-sided cooling is used, then the device structure is simple, but the wafer temperature uniformity deteriorates
Solution Approach 1:
The cooling system is divided into two independent flow paths positioned on opposite surfaces of the plate. This segmentation enables balanced thermal control from both sides, ensuring uniform temperature distribution across the wafer surface while keeping the overall device structure relatively simple.
Solution Approach 2:
Each cooling flow path is equipped with spiral-shaped cooling fins that provide localized enhanced heat transfer on both the top and bottom surfaces. This local quality improvement ensures uniform cooling across different regions of the plate, directly improving wafer temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves uniform heating of the heater plate, preventing deformation and improving temperature uniformity on the wafer, thereby enhancing semiconductor device yield.
Implementation Method 1
When an electric current is supplied to the heating element via a line located inside the shaft, the heating element is heated, and the wafer is heated by the heat generated in the heating element
Implementation Method 2
a first cooling plate provided on a bottom surface of the heater plate and having a first flow path, and a second cooling plate provided on a top surface of the heater plate and having a second flow path
Implementation Method 3
a tube supplying a coolant to the first cooling plate and the second cooling plate
Data Source
AI summary
A substrate support device includes a plate portion including a heater plate that includes a heating element provided in the heater plate, and also including a first cooling plate provided on a bottom surface of the heater plate and having a first flow path, and a second cooling plate provided on a top surface of the heater plate and having a second flow path; and a shaft portion supporting the plate portion and including a line connected to the heating element to supply an electric current to the heating element, and a tube supplying a coolant to the first cooling plate and the second cooling plate, the line and the tube being provided inside the shaft portion.