Substrate Support Electrode Overlap for Tilt and Plasma Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate supports face a trade-off between tilt controllability and uniformity of plasma density in the circumferential direction, where improving one aspect often deteriorates the other due to the configuration of electrodes, leading to suboptimal performance in plasma processing.
Innovation Solution
A substrate support design featuring a first bias electrode below the substrate support surface and a second bias electrode below the ring support surface, with overlapping regions outside the substrate support surface, allows for independent control of tilt and plasma density uniformity by minimizing electromagnetic interference and optimizing the crosstalk region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the first bias electrode and second bias electrode are positioned to face each other within the substrate region, then tilt controllability is improved, but uniformity of plasma density in the circumferential direction deteriorates
Solution Approach 1:
The patent moves the overlapping region of the first and second bias electrodes from the substrate support surface region to a region outside the substrate support surface and below the ring support surface. This spatial relocation in the vertical dimension eliminates the harmful electromagnetic interference within the substrate region while preserving the crosstalk necessary for tilt control, thereby resolving the contradiction between tilt controllability and plasma density uniformity.
2Ease of operation
If the first bias electrode and second bias electrode overlap in the substrate region, then tilt control is enhanced, but electromagnetic interference increases affecting plasma processing
Solution Approach 1:
The patent extracts the overlapping region of the bias electrodes from the substrate support surface region and relocates it to a region outside the substrate support surface. This separation removes the harmful electromagnetic interference from the plasma processing region while maintaining the electrode crosstalk necessary for tilt control, effectively resolving the contradiction between tilt control enhancement and electromagnetic interference reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains tilt controllability while enhancing the uniformity of plasma density in the circumferential direction, improving the overall performance of plasma processing by reducing the boundary of plasma density and minimizing electromagnetic influences.
Implementation Method 1
The electrostatic chuck includes a first bias electrode and a second bias electrode, the first bias electrode is provided at least partially below the substrate support surface, the second bias electrode is provided at least partially below the ring support surface
Data Source
AI summary
There is provided a substrate support that achieves both tilt controllability and uniformity of plasma density in a circumferential direction of a substrate. The substrate support includes: a substrate support surface for supporting the substrate; a ring support surface for supporting an edge ring; and an electrostatic chuck. The electrostatic chuck includes a first bias electrode and a second bias electrode, the first bias electrode is provided at least partially below the substrate support surface, the second bias electrode is provided at least partially below the ring support surface, and the first bias electrode and the second bias electrode overlap each other in a plan view in at least a partial region outside the substrate support surface and below the ring support surface.