Substrate Support Structure for Uniform Deposition and EMI Shielding
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Solution Overview
Problem
Existing substrate supports in deposition chambers face challenges with temperature uniformity and electromagnetic interference, which affect the uniform deposition of films on substrates, and are also susceptible to corrosion from cleaning gases, reducing their usable life.
Innovation Solution
A substrate support comprising a dielectric body with embedded foils and an electrically conductive mesh, a center tap structure for electrical communication, and a support arm housing a temperature sensor and ground cable, with dielectric members to isolate the cables and protect against corrosive gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrostatic chuck is coupled to a ground potential, then electromagnetic interference is reduced, but temperature monitoring device operation is negatively affected
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the ground potential and the temperature monitoring device. This dielectric barrier allows the ground to be maintained while blocking electromagnetic interference from reaching the temperature sensor, thus preserving measurement precision while still providing electromagnetic shielding.
2Productivity
If traditional substrate support hardware is used, then deposition function is achieved, but corrosive cleaning gases shorten the usable life of the hardware
Solution Approach 1:
The substrate support hardware is constructed using composite materials that combine corrosion-resistant properties with functional requirements. The body is made from a corrosion-resistant material, and a dielectric layer is applied as a protective coating, creating a composite structure that resists corrosive cleaning gases while maintaining deposition functionality.
3Ease of manufacture
If the substrate support structure is simplified, then manufacturing is easier, but temperature uniformity and electromagnetic shielding are compromised
Solution Approach 1:
The substrate support is segmented into distinct functional layers: a corrosion-resistant body, an embedded heating element layer, and a dielectric protective layer. This segmentation allows each layer to be optimized for its specific function while maintaining overall manufacturing simplicity through modular construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity on the substrate, minimizes electromagnetic interference, and extends the lifespan of the substrate support by protecting it from corrosive gases.
Implementation Method 1
a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes an electrically conductive mesh embedded in the body below the first foil
Implementation Method 2
a dielectric member separating the ground cable and the temperature sensor
Data Source
AI summary
The present disclosure generally relates to a substrate support that includes a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes an electrically conductive mesh embedded in the body below the first foil. The body also includes a center tap structure formed in a bottom surface of the body that is in electrical communication with the mesh.