Substrate Support Assembly With Recessed Insulator for EMO Heat Protection
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Solution Overview
Problem
Conventional substrate support systems face challenges in protecting temperature-sensitive components from high temperatures during emergency machine off conditions, leading to potential damage and operational disruptions due to residual heat transfer and thermal expansion issues.
Innovation Solution
A substrate support assembly is designed with a recessed insulator plate and a ceramic or alumina insulator to reduce heat transfer and include a conical washer for securing electrical connections, which limits contact between components and maintains thermal insulation, thereby protecting sensitive components from elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate support systems are used without additional insulation, then the structure remains simple, but temperature-sensitive components are damaged by residual heat transfer during emergency machine off conditions
Solution Approach 1:
An insulator plate is introduced as an intermediary component between the substrate support puck and the base plate. This insulator plate acts as a thermal barrier that mediates heat transfer, protecting temperature-sensitive components (power distribution assembly, control electronics) from residual heat during emergency machine off conditions, while maintaining structural integrity.
Solution Approach 2:
The base plate is segmented into different regions with varying thermal conductivity. A first region (first portion) has lower thermal conductivity than a second region (second portion), allowing selective thermal management. This segmentation enables the system to protect sensitive components while maintaining necessary thermal pathways in other areas.
2Reliability
If the insulator plate is placed in direct contact with the substrate support puck, then heat transfer is reduced, but thermal expansion causes contact loss and insulation failure
Solution Approach 1:
The design explicitly accounts for thermal expansion by creating a compliant mounting structure that maintains contact between the insulator plate and the substrate support puck even when thermal expansion occurs. The insulator plate is mounted in a manner that allows it to expand and contract without losing contact, ensuring continuous thermal insulation effectiveness throughout temperature cycling.
3Stability of the object's composition
If the insulator plate is recessed to maintain contact during thermal expansion, then contact stability is improved, but heat transfer reduction effectiveness decreases
Solution Approach 1:
The insulator plate features localized recesses or recessed regions at specific contact points with the substrate support puck and base plate. These localized recesses accommodate thermal expansion in critical areas while maintaining overall insulation effectiveness. The recesses are strategically positioned to preserve contact stability without significantly compromising the thermal barrier function of the insulator plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature-related damage to sensitive components, maintains operational integrity by controlling heat transfer, and prevents thermal expansion-induced failures during emergency machine off conditions.
Implementation Method 1
The insulator reduces heat transfer to the component of the process chamber in an emergency machine off (EMO) condition
Implementation Method 2
A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface
Data Source
AI summary
A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.