Substrate Support Flow Path Layout for Temperature Uniformity

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Solution Overview

Problem

Existing substrate supports in plasma processing systems lack effective controllability of substrate temperature, leading to inefficiencies in temperature uniformity and control.

Innovation Solution

A substrate support design featuring a base with a central first flow path and a surrounding second flow path, along with radially extending third and fourth flow paths, which facilitate improved heat exchange and temperature control through coaxial arrangement and heat dissipation fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a simple flow path design is used, then device complexity is reduced, but temperature uniformity and controllability deteriorate

Engineering Contradiction:
Improveflow path structureVSAvoidtemperature uniformity
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The flow path is segmented into multiple independent channels: a first flow path extending radially from the center, and a second flow path extending radially from the periphery. This segmentation allows independent temperature control of different substrate regions, improving temperature uniformity and controllability while maintaining a relatively simple overall structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate support are provided with different flow path configurations. The central region has the first flow path while the peripheral region has the second flow path, allowing localized temperature control tailored to the specific thermal requirements of each region, thereby achieving better overall temperature uniformity.

Inventive Principle:
Principle #3Local quality

2Device complexity

If a single flow path is used, then device complexity is reduced, but temperature controllability deteriorates

Engineering Contradiction:
Improveflow path configurationVSAvoidtemperature controllability
Core Design Contradiction:
Device complexityVSEase of operation

Solution Approach 1:

The cooling system is divided into two separate flow paths that can be independently controlled. The first flow path serves the central substrate region while the second flow path serves the peripheral region, enabling independent temperature adjustment for different areas and thus improving overall temperature controllability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flow path design enables dynamic temperature control by allowing different flow rates and temperatures to be supplied to different regions of the substrate. This dynamic adjustment capability improves temperature controllability without significantly increasing device complexity.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances controllability of substrate temperature and achieves improved in-plane temperature uniformity by facilitating coaxial temperature control and efficient heat removal.

Implementation Method 1

a base (111) having a flow path (50) formed therein

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first flow path (51) extending from a central portion toward an outer peripheral portion of the base (111)... a second flow path (52) extending from the central portion toward the outer peripheral portion of the base (111)

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12300475B2Substrate support and substrate processing apparatus
Publication Date: 2025.05.13 TOKYO ELECTRON LTD
  • US12300475B2 patent drawing
  • US12300475B2 patent drawing
  • US12300475B2 patent drawing

AI summary

There is provided a substrate support comprising: a base; a first flow path that opens on a bottom surface of the base at a central portion of the base; a second flow path that surrounds the first flow path and opens on the bottom surface of the base; at least one third flow path communicating with the first flow path and arranged from the central portion toward an outer peripheral portion of the base; and at least one fourth flow path communicating with the second flow path, arranged from the central portion toward the outer peripheral portion of the base, and communicating with the at least one third flow path at the outer peripheral portion of the base.