Substrate Support Thermal Control With Variable Fluid Flow
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Solution Overview
Problem
Existing semiconductor processing chambers face challenges in maintaining temperature efficiency during both active processing and idle or sleep modes, leading to increased energy consumption due to inconsistent heat management.
Innovation Solution
A system is implemented that controls the flow rate of heat transfer fluid in combination with heating elements to maintain the processing chamber temperature within specified ranges, using flow control valves or variable pumps to adjust the fluid flow based on processing modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat transfer fluid is circulated at a constant flow rate to maintain chamber temperature, then temperature control is achieved, but energy consumption increases during idle or sleep modes
Solution Approach 1:
The patent applies dynamics by making the heat transfer fluid flow rate adjustable rather than constant. The system dynamically changes the flow rate based on processing mode: during active processing, a higher flow rate removes process heat, while during idle or sleep modes, a reduced flow rate minimizes energy consumption while maintaining temperature control capability.
Solution Approach 2:
The patent changes the operational parameters of the heat transfer fluid system by adjusting the flow rate according to different processing modes. This parameter change allows the system to optimize between temperature control effectiveness and energy efficiency, reducing the flow rate during idle periods when less heat removal is needed.
2Use of energy by moving object
If heat transfer fluid flow rate is reduced during idle modes to save energy, then energy consumption decreases, but temperature maintenance capability may be compromised
Solution Approach 1:
The patent implements feedback control where the system monitors processing mode and adjusts the heat transfer fluid flow rate accordingly. During idle or sleep modes, the reduced flow rate is controlled based on the system state, ensuring temperature maintenance capability is preserved while optimizing energy consumption. The heating elements work in coordination with the variable flow rate to maintain the required temperature range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy consumption by optimizing heat removal during idle or sleep modes, allowing for more efficient temperature maintenance with less power usage.
Implementation Method 1
a heat transfer fluid is circulated in the chamber at a first flow rate configured to remove heat energy from the chamber
Implementation Method 2
one or more heating elements; and a flow control module configured to adjust a flow rate of the heat transfer fluid
Data Source
AI summary
Semiconductor processing systems and system components are described for providing thermal control in semiconductor fabrication. One of the systems includes a processing chamber, the processing chamber comprising: a chamber volume, and a substrate support positioned within the chamber volume, the substrate support comprising one or more heating elements and a fluid path configured to circulate a heat transfer fluid within a body of the substrate support; and a flow control module configured to adjust a flow rate of the heat transfer fluid circulating through the body of the substrate support according to a processing heat load applied to the substrate by the processing chamber.