Substrate support for use with multi-zonal heating sources
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Solution Overview
Problem
Conventional substrate supports used with multi-zonal lamp heating systems diffuse thermal zones, inhibiting process uniformity during substrate processes like epitaxial deposition.
Innovation Solution
A substrate support with a pocket and lip configuration, featuring alternating peaks and valleys to control thermal conductance, operates in conjunction with multi-zonal heating sources to provide a desired temperature profile on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional substrate supports are used with multi-zonal lamp heating, then the substrate can be heated, but the thermal zones are diffused and process uniformity is inhibited
Solution Approach 1:
The substrate support features a non-uniform pocket surface with alternating peaks and valleys, where different regions have different thermal conductance properties. The peaks provide higher thermal conductance while the valleys provide lower thermal conductance, allowing local customization of heat transfer to maintain distinct thermal zones and achieve uniform temperature profile across the substrate.
Solution Approach 2:
The pocket surface is segmented into multiple alternating peak and valley regions, creating distinct thermal zones that correspond to the multi-zonal lamp heating zones. This segmentation allows independent control of heat transfer in different radial regions, preventing thermal zone diffusion while maintaining overall temperature uniformity.
2Temperature
If the substrate support uses a simple flat surface, then the structure is simple, but it cannot provide the desired temperature profile control
Solution Approach 1:
The pocket surface incorporates localized peaks and valleys with specific geometries optimized for thermal control. These local variations in surface topology create regions of different thermal conductance, enabling precise control over heat distribution from the substrate support to the substrate without requiring complex external heating/cooling systems.
3Temperature
If the substrate is placed directly on the pocket surface, then contact is maximized, but thermal diffusion increases and uniformity is reduced
Solution Approach 1:
The alternating peaks and valleys create a patterned contact interface where the substrate touches the support at peak locations (high thermal conductance) while valleys provide spacing (low thermal conductance). This localized contact strategy maintains reliable mechanical support while controlling thermal diffusion to preserve temperature uniformity across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support system effectively maintains a uniform temperature profile on the substrate, enhancing process uniformity and control during thermal processing.
Implementation Method 1
Multi-zonal lamp heating may be utilized to provide thermal energy to multiple zones on a substrate
Implementation Method 2
a plurality of features to operate in combination with a plurality of heating zones provided by a multi-zonal heating source to provide a desired temperature profile
Data Source
AI summary
Apparatus for use with multi-zonal heating sources are provided. In some embodiments, a substrate support may have a pocket disposed in a surface of the substrate support and a lip disposed about the pocket to receive an edge of a substrate and to support the substrate over the pocket such that a gap is defined between a pocket surface and a backside surface of the substrate when the substrate is disposed on the lip; a plurality of features to operate in combination with a plurality of heating zones provided by a multi-zonal heating source to provide a desired temperature profile on a frontside surface of a substrate when the substrate is disposed on the lip, and wherein the plurality of features are alternatingly disposed above and below a baseline surface profile of the pocket surface in a radial direction from a central axis of the substrate support.