Substrate Support Grid for Laser Alignment
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Solution Overview
Problem
In the photolithography process for semiconductor wafer patterning, accurately targeting and heating the anchor pattern on a mask is challenging due to deviations in critical dimensions between monitoring and anchor patterns, leading to inaccurate etching and correction processes.
Innovation Solution
A substrate treating apparatus with a support unit, liquid supply unit, and optical module, featuring a teaching member with a grid to precisely align the laser irradiation center over the anchor pattern, ensuring accurate etching and heating of specific regions on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the optical module moves to a preset position based on calculated distance from the center of the irradiation region to the anchor pattern, then the laser can be irradiated to the anchor pattern, but if the center of the pre-set laser irradiation region is separated from the center of the mask, the optical module moves to a different position from the actual anchor pattern position, resulting in inaccurate etching
Solution Approach 1:
The patent applies preliminary action by performing a teaching process before the actual etching process. The teaching member with grid patterns is used to pre-align and calibrate the optical module's position and orientation relative to the mask center. This preliminary calibration ensures that when the optical module subsequently moves to irradiate the anchor pattern, the positioning is accurate despite any initial separation between the preset irradiation region center and the mask center.
Solution Approach 2:
The teaching member serves as an intermediary element between the optical module and the actual workpiece (mask with anchor pattern). The teaching member's grid patterns provide reference markers that enable the optical module to determine its position and orientation accurately. This intermediary calibration step bridges the gap between the preset irradiation region and the actual mask center, ensuring precise subsequent etching of the anchor pattern.
2Manufacturing precision
If a teaching member with a grid is introduced to align the laser irradiation center, then the laser can be accurately targeted at the anchor pattern, but the device complexity increases
Solution Approach 1:
The teaching member creates a simplified copy or representation of the reference frame needed for alignment. Instead of directly aligning with the complex anchor pattern on the mask, the system uses a teaching member with simple grid patterns that replicate the essential alignment information. This copying approach enables accurate laser targeting through a simpler, more manageable reference structure that can be easily imaged and processed by the optical module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise etching and heating of substrate regions, correcting critical dimension deviations and improving the accuracy of pattern formation on masks by ensuring the laser is accurately targeted and aligned with the anchor pattern.
Implementation Method 1
an optical module for heating the substrate supported on the support unit
Implementation Method 2
the anchor pattern formed on the mask is heated by a laser
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to rotate and support a substrate; a liquid supply unit configured to supply a liquid to the substrate supported on the support unit; and an optical module for heating the substrate supported on the support unit, and wherein the support unit includes a teaching member having a grid displaying a reference point which matches a center of the support unit.