Substrate Support Unit Height Adjustment for Hydrophobic Treatment
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Solution Overview
Problem
Conventional hydrophobization processes only address the upper surface of substrates, leading to staining issues during wet etching and potential damage due to the 'squeeze effect' when attempting to hydrophobize the lower surface, which is not adequately supported.
Innovation Solution
A substrate treating apparatus with a support unit that includes a heating member and a height adjustment mechanism, utilizing a plunger and proximity pins to adjust the substrate's position and apply hydrophobic gas evenly to both surfaces, minimizing the squeeze effect during heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is raised by lift pins to hydrophobize the lower surface, then the lower surface can be treated, but the substrate bounces up due to squeeze effect and gets damaged
Solution Approach 1:
The support plate provides upward support force to counterbalance the downward squeeze effect when lift pins raise the substrate. This counteracting force prevents the substrate from bouncing up and getting damaged, allowing safe hydrophobization of the lower surface.
Solution Approach 2:
The support plate acts as an intermediary between the substrate and the treatment chamber floor. It provides a stable platform that distributes the substrate's weight and prevents direct contact with potential damage sources, enabling safe manipulation during the hydrophobization process.
2Ease of manufacture
If only the upper surface is hydrophobicized, then the process is simple, but staining occurs during wet etching
Solution Approach 1:
The system dynamically adjusts the substrate position between treating the upper surface and lower surface. The support plate can move the substrate to different heights, allowing sequential treatment of both surfaces without requiring separate processing steps, thus maintaining simplicity while achieving complete hydrophobization.
Solution Approach 2:
The invention adds vertical dimension to the hydrophobization process by raising the substrate using lift pins. This allows the lower surface to be exposed to and treated by hydrophobic gas, transforming a single-surface treatment into a dual-surface treatment through spatial manipulation.
3Reliability
If the substrate position is fixed during treatment, then the setup is simple, but both surfaces cannot be effectively hydrophobicized
Solution Approach 1:
The position adjustment system is segmented into independent components: lift pins for vertical movement and a support plate for lateral positioning. This modular segmentation allows simple, discrete adjustments to treat different surfaces without requiring complex integrated mechanisms.
Solution Approach 2:
The support plate automatically adjusts the substrate position to optimal treatment locations. The system self-regulates the substrate's vertical and lateral positions to ensure both surfaces are properly exposed to hydrophobic gas, reducing the need for manual intervention or complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively hydrophobizes both surfaces of the substrate, preventing staining and reducing the risk of damage by uniformly applying heat and gas treatment, while minimizing the squeeze effect.
Implementation Method 1
a heating member that heats the substrate placed on the support plate
Implementation Method 2
a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate
Data Source
AI summary
An apparatus for treating a substrate includes a housing having a treatment space inside, a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate, and a support unit that supports the substrate in the treatment space. The support unit includes a support plate, a heating member that heats the substrate placed on the support plate, and a height adjustment member that changes a position of the substrate between a first position spaced apart upward from an upper surface of the support plate by a first distance and a second position spaced apart upward from the upper surface of the support plate by a second distance, and the second position is a higher position than the first position.