Substrate Support Hole Layout for Uniform Mask Deposition
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Solution Overview
Problem
Existing deposition devices for semiconductor and display manufacturing suffer from defects in line patterns due to uneven magnetic forces affecting the deposition mask's adherence to the substrate, leading to irregular film thickness and display defects like horizontal stripes.
Innovation Solution
A deposition device with a substrate support featuring multiple holes aligned with the spaces between magnets, which distorts the magnetic force to stabilize the deposition mask, ensuring uniform deposition by reducing the intensity and increasing the width of the magnetic force peaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a magnet is used to adhere the deposition mask to the substrate, then the deposition mask is fixed to the substrate, but uneven magnetic force causes line pattern defects and non-uniform film thickness
Solution Approach 1:
The substrate support is segmented with multiple holes distributed across its surface. This segmentation allows the magnetic field to pass through the holes, creating multiple localized adhesion points rather than a single continuous magnetic field, thereby distributing the magnetic force more uniformly across the deposition mask and reducing line pattern defects
Solution Approach 2:
The substrate support acts as an intermediary component between the magnet and the substrate. It includes multiple holes that modulate the magnetic field distribution, transforming the concentrated magnetic force into a more uniform distribution pattern that adheres the deposition mask evenly to the substrate without causing line pattern defects
2Force
If the magnetic force is strong enough to fix the deposition mask, then adhesion is improved, but line pattern defects and horizontal stripes appear in the deposited layer
Solution Approach 1:
The substrate support provides locally varied magnetic field distribution through its hole pattern. Different regions of the substrate support have different magnetic field intensities depending on the hole distribution, allowing strong overall adhesion while preventing localized magnetic force peaks that would cause line pattern defects and horizontal stripes in the deposited organic material layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the severity of line pattern defects by smoothing the magnetic force distribution, resulting in more uniform film thickness and improved display quality by minimizing periodic deviations in the deposited layer.
Implementation Method 1
A magnet may be used to proceed with the deposition process by adhering the deposition mask to the substrate
Implementation Method 2
multiple holes aligned with the spaces between magnets, which distorts the magnetic force to stabilize the deposition mask, ensuring uniform deposition by reducing the intensity and increasing the width of the magnetic force peaks
Data Source
AI summary
A deposition device includes a magnet portion including a plurality of magnets, and a substrate support that supports a substrate and faces the magnet portion. The substrate support includes a plurality of holes, and each of the plurality of holes is disposed on the substrate support corresponding to a space between corresponding adjacent ones of the plurality of magnets.