Substrate Support Assembly Rating via Impedance Electron Flow
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Solution Overview
Problem
Substrate support assemblies in manufacturing systems often have defective electrical components, which can damage substrates and lead to inefficiencies and increased system latency due to the need for significant changes in process recipes.
Innovation Solution
A system and method for rating substrate support assemblies based on impedance circuit electron flow, using a trained machine learning model to analyze data from RF power flow through electrical components, and assigning quality ratings based on electron flow criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate support assemblies are used without prior quality rating, then manufacturing productivity is maintained, but substrate damage occurs and system latency increases
Solution Approach 1:
The patent implements preliminary quality rating of substrate support assemblies by measuring electron flow characteristics before installation. The system performs electron flow measurements through impedance circuits during manufacturing, assigns quality ratings based on measured values, and stores these ratings for future reference. This preliminary assessment prevents defective assemblies from causing substrate damage while enabling quick selection of rated assemblies during production, thus maintaining productivity.
2Reliability
If electron flow measurement and quality rating system is implemented, then substrate damage is prevented, but device complexity increases
Solution Approach 1:
The patent replaces complex physical inspection and testing methods with electrical measurements of electron flow through impedance circuits. Instead of mechanical or visual inspection of electrical components, the system uses electrical current measurements to assess component health and assign quality ratings. This substitution simplifies the testing system while effectively identifying defective electrical components in substrate support assemblies.
3Reliability
If defective substrate support assemblies are identified and removed, then substrate damage is prevented, but loss of time occurs during assembly selection
Solution Approach 1:
The patent performs electron flow measurements and quality rating assignments during the manufacturing process itself, before the assemblies are deployed. The measured electron flow values and assigned quality ratings are stored in a database or on the assemblies themselves. During production, pre-rated assemblies can be quickly selected based on their stored ratings without requiring time-consuming on-site testing, thus preventing substrate damage while minimizing selection time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the identification of substrate support assemblies with defective electrical components before installation, preventing substrate damage and reducing system resource wastage, thereby decreasing overall system latency and increasing efficiency.
Implementation Method 1
extracting, from the one or more outputs, a measurement value for an electron flow across an impedance circuit of the current substrate support assembly
Implementation Method 2
data associated with an amount of radio frequency (RF) power flowed through an electrical component of a current substrate support assembly during a current testing process
Data Source
AI summary
Data associated with a power testing process performed for a substrate support assembly is provided as input to a trained machine learning model. A measurement value for an electron flow across one or more components of the substrate support assembly in accordance with the power testing process is obtained based on one or more outputs of the trained machine learning model. A first quality rating or a second quality rating is assigned to the substrate support assembly based on whether the measurement value satisfies an electron flow criterion, wherein the first quality rating indicates a higher quality than the second quality rating. An indication of whether the substrate support assembly is to be installed at a processing chamber in view of the assigned second quality rating is transmitted to a client device.