Substrate Support With Integrated Circuit Board Temperature Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in downsizing due to the need for extensive wiring for control circuits outside the chamber, and the accuracy of environmental control is compromised at extreme temperatures, leading to decreased processing accuracy.
Innovation Solution
A substrate support with an integrated electronic circuit board and temperature adjusting elements within the substrate processing apparatus, allowing for precise temperature control of the circuit board and reducing the need for external wiring, while also maintaining accurate environmental control across varying temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the control circuit is arranged outside the chamber, then the wiring complexity is reduced, but the apparatus size increases and temperature control accuracy deteriorates
Solution Approach 1:
The patent merges the control circuit with the substrate support structure by integrating it into the chamber environment. The control circuit is positioned within the chamber space, combining functions that were previously separated (control outside chamber vs. compact integration), thereby reducing wiring complexity while maintaining compact apparatus size.
2Device complexity
If the control circuit is arranged outside the chamber, then the wiring complexity is reduced, but the temperature control accuracy deteriorates
Solution Approach 1:
The patent introduces a temperature adjusting element (heater) as an intermediary between the control circuit and the substrate support. This intermediary component enables precise temperature control of the substrate support by the control circuit, even when the control circuit operates in the chamber environment, thereby maintaining temperature control accuracy while reducing wiring complexity.
3Volume of stationary object
If the electronic circuit board is integrated within the substrate support, then the apparatus size is reduced, but the temperature control of the circuit board becomes challenging
Solution Approach 1:
The patent uses a temperature adjusting element (heater) as an intermediary to actively control the temperature of the electronic circuit board. The heater is positioned to provide thermal adjustment to the circuit board, enabling precise temperature control despite the board's integration within the substrate support structure, thereby maintaining compact apparatus size while achieving proper temperature management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated solution enables more compact substrate processing apparatus designs and maintains high accuracy in environmental control, even at extreme temperatures, thereby improving processing precision.
Implementation Method 1
at least one temperature adjusting element disposed in the internal space, the at least one temperature adjusting element being configured to adjust a temperature of the electronic circuit board
Data Source
AI summary
A substrate support for use in a substrate processing apparatus includes: a base having an internal space; an electronic circuit board disposed in the internal space; a substrate supporting plate disposed on the base; and at least one temperature adjusting element disposed in the internal space, the at least one temperature adjusting element being configured to adjust a temperature of the electronic circuit board.