Substrate Support Joining Layer for High-Temperature Uniformity

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Solution Overview

Problem

Conventional substrate support units in semiconductor manufacturing face issues with thermal durability and temperature non-uniformity due to the use of organic bonders, which degrade at high temperatures, leading to reduced adhesive strength and warpage, limiting process temperature and causing non-uniform temperature distribution.

Innovation Solution

A substrate support unit with an intermediate layer that includes a brazing-based joining part to couple a chucking component and a base component, featuring a heat transfer part with adjustable heat transfer performance through a gas injection system, minimizing thermal stress and enhancing thermal buffering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an organic bonder is used to join the chucking component and base component, then the thermal buffering effect is improved, but the heat resistance and thermal durability deteriorate at high temperatures

Engineering Contradiction:

Improvethermal buffering effectVSAvoidheat resistance and thermal durability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent introduces an intermediate layer as a mediator between the chucking component and base component. This intermediate layer comprises a porous layer and a buffer layer, where the porous layer provides thermal buffering through its void spaces while the buffer layer offers thermal stability and adhesion at high temperatures, eliminating the need for organic bonders with limited heat resistance

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite structure consisting of multiple layers with different functions: a porous layer (made of porous ceramic or glass) for thermal buffering, a buffer layer (made of inorganic material) for thermal stability and adhesion, and optionally a primer layer. This composite material approach allows simultaneous achievement of thermal buffering and high-temperature durability

Inventive Principle:

Principle #40Composite materials

2Temperature

If the organic bonder is exposed to high temperatures for extended periods, then the process temperature can be increased, but the adhesive strength and thermal durability are reduced due to deterioration

Engineering Contradiction:

Improveprocess temperatureVSAvoidadhesive strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent replaces the disposable organic bonder with a durable inorganic intermediate layer system that can withstand repeated high-temperature cycles without degradation. The inorganic materials (porous ceramic, glass, metal oxides) maintain their structural integrity and adhesive properties even after extended exposure to high temperatures, eliminating the need for replacement due to deterioration

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If the organic bonder deteriorates due to plasma damage and high temperature, then the thermal buffering effect decreases, but temperature non-uniformity and warpage increase

Engineering Contradiction:

Improvethermal buffering effectVSAvoidtemperature distribution uniformity

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameters from organic to inorganic, fundamentally altering the thermal and chemical properties of the joining layer. The inorganic intermediate layer maintains stable thermal conductivity and buffering characteristics under plasma exposure and high temperature, preventing the temperature non-uniformity and warpage that occur with organic bonder deterioration

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved thermal stability and adjustable heat transfer performance, ensuring consistent temperature distribution and durability during high-temperature processes, thereby enhancing the reliability of substrate processing.

Implementation Method 1

The intermediate layer with a joining part formed by using a local metallization brazing method, the thermal stress of the intermediate layer can be minimized

Methodology Applied

Scientific EffectThermal buffering: Thermal Insulation

Implementation Method 2

coupling a partial region of a bottom surface of the chucking component and a corresponding partial region of an upper surface of the base component by brazing

Methodology Applied

Scientific EffectBrazing: Brazing

Implementation Method 3

depositing a metal film on the bottom surface of the chucking component by vacuum deposition or plating

Methodology Applied

Scientific EffectVacuum deposition: Physical Vapour Deposition

Data Source

PatentUS12438028B2Substrate support unit, method of manufacturing the same, and substrate processing apparatus including the same

Publication Date: 2025.10.07 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

Proposed is a substrate support unit, a method of manufacturing the same, and a substrate processing apparatus including the same. The substrate support unit includes a base component, a chucking component mounted on the base component, and an intermediate layer interposed between the base component and the chucking component, wherein the intermediate layer includes a joining part formed in a partial region to couple the base component and the chucking component.