Substrate Support Pin Structure for Thermal Expansion Misalignment
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Solution Overview
Problem
In substrate processing apparatuses, the displacement of through-holes due to thermal expansion differences between substrate support members can lead to damage of lifter pins and abnormal discharge during plasma processing, as existing solutions require large gaps to accommodate displacement, which can result in plasma process inefficiencies.
Innovation Solution
A substrate support design with a base and support portion featuring first and second through-holes of varying diameters on opposite sides, allowing the pin members to move axially and maintain contact even when the through-holes are displaced, thereby reducing the gap between the pin and through-hole while preventing abnormal discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large gap is provided between the through-hole and pin to accommodate thermal expansion displacement, then the pin can move freely without damage, but abnormal discharge occurs during plasma processing and plasma process efficiency decreases
Solution Approach 1:
The pin is divided into two separate pin members (first pin member and second pin member) that can move independently within the through-hole. This segmentation allows each pin member to accommodate thermal expansion displacement separately, maintaining reliability while reducing the overall gap needed, thus preventing abnormal discharge during plasma processing.
2Adaptability or versatility
If the through-hole diameter is increased to allow pin movement during thermal expansion, then the pin can accommodate displacement, but the gap between pin and through-hole increases causing plasma process inefficiency
Solution Approach 1:
The pin members are designed to be movable within the through-hole, allowing dynamic adjustment during thermal expansion. The first pin member can move axially and the second pin member can move radially, enabling the system to adapt to thermal expansion without requiring a larger through-hole diameter, thus maintaining plasma process efficiency.
3Reliability
If the pin is made movable to accommodate through-hole displacement, then thermal expansion damage is prevented, but the structure becomes more complex with multiple pin members and movement mechanisms
Solution Approach 1:
The first pin member and second pin member are nested within the same through-hole, with the first pin member positioned axially and the second pin member positioned radially. This nesting arrangement allows both pin members to accommodate thermal expansion displacement within a compact structure, achieving reliability without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the pin members to maintain functionality and prevent abnormal discharge by allowing axial movement and maintaining contact, even when through-holes are displaced, thus enhancing the reliability and efficiency of plasma processing.
Implementation Method 1
the displacement of through-holes due to thermal expansion differences between substrate support members
Data Source
AI summary
A substrate support includes a base, a support portion, a first pin member, a second pin member and a driving unit. The base has a first surface on which an object to be supported is placed, a second surface opposite to the first surface, and a first through-hole. The support portion has a third surface in contact with the second surface, a fourth surface opposite to the third surface, and a second through-hole. The first pin member is stored in the first through-hole and a second pin member is stored in the second through-hole. The first through-hole is larger on the second surface side than on the first surface side, and/or the second through-hole is larger on the third surface side than on the fourth surface side.