Substrate Support Calibration Using Backside Pressure Position Sensing
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Solution Overview
Problem
Conventional substrate processing systems face challenges in accurately calibrating substrate positioning on a substrate support, leading to process non-uniformity and requiring time-consuming iterations of substrate processes, measurements, analysis, and robot handoff adjustments.
Innovation Solution
The method involves obtaining backside pressure values at various substrate positions on a substrate support using a calibration substrate with through holes, and analyzing these values to determine a calibrated substrate position, thereby eliminating the need for process contour mapping and improving calibration repeatability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If process contour mapping and iterative substrate processes are used for calibration, then substrate positioning accuracy can be improved, but calibration time and operational complexity increase significantly
Solution Approach 1:
The patent replaces the mechanical/physical process-based calibration method (process contour mapping) with a pressure-based measurement system. By using pressure sensors to detect substrate position through vacuum pressure variations, the system eliminates the need for time-consuming iterative substrate processing and contour mapping, achieving rapid positioning calibration without sacrificing accuracy
Solution Approach 2:
The patent introduces pressure sensors as an intermediary measurement tool between the substrate and the positioning system. Instead of directly measuring substrate position through complex process mapping, the pressure sensors detect positional information through vacuum pressure variations, providing an indirect but efficient measurement pathway that reduces calibration time
2Manufacturing precision
If manual substrate placement calibration is performed, then positioning accuracy can be adjusted, but operator-dependent variations reduce measurement precision
Solution Approach 1:
The patent enables the substrate positioning system to self-calibrate using automated pressure-based detection. The pressure sensors automatically detect substrate position and provide feedback for adjustment, eliminating manual operator involvement and its associated variability. This self-service calibration approach ensures consistent, repeatable measurements regardless of which operator performs the calibration
Solution Approach 2:
The patent implements a feedback mechanism where pressure sensor measurements of substrate position are fed back to the positioning control system. This closed-loop feedback enables automated adjustment of substrate placement based on actual measured positions, improving both accuracy and repeatability by eliminating human judgment variability from the calibration process
3Manufacturing precision
If iterative substrate processes and robot handoff adjustments are performed, then substrate positioning can be calibrated, but device complexity and operational difficulty increase
Solution Approach 1:
The patent extracts the calibration measurement function from the complex iterative substrate processing sequence and implements it as a separate, standalone pressure-based measurement system. By taking out the positioning measurement task and handling it independently through pressure sensors, the system simplifies the overall calibration process while maintaining the ability to achieve precise substrate positioning
Solution Approach 2:
The patent performs substrate position measurement using pressure sensors before actual substrate processing begins. By preliminarily determining the correct substrate position through pressure-based detection and making necessary adjustments in advance, the system eliminates the need for complex iterative adjustments during the processing sequence, thereby reducing operational complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise calibration of substrate positioning without performing actual processes, reducing operator-dependent variations and streamlining the calibration process, thus enhancing the consistency and efficiency of substrate processing.
Implementation Method 1
vacuum chucking the substrate to the substrate support and measuring a backside pressure
Data Source
AI summary
Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.