Substrate Support Protrusion Sensor for Temperature Measurement
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Solution Overview
Problem
Existing substrate treatment apparatuses require temperature correction work due to discrepancies between measured support plate temperatures and actual substrate temperatures, which can be inaccurately performed based on operator skill.
Innovation Solution
An apparatus with a substrate support unit featuring a support protrusion and integrated temperature sensor that directly measures the substrate's temperature, eliminating the need for temperature correction by ensuring accurate temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a temperature sensor is installed on the support plate to measure temperature, then the temperature measurement is simplified, but the measured temperature value differs from the actual substrate temperature
Solution Approach 1:
A thermal conductor is introduced as an intermediary between the support plate and the substrate. This thermal conductor has high thermal conductivity to efficiently transfer heat from the support plate to the substrate, ensuring that the substrate reaches the desired temperature while the temperature sensor on the support plate accurately reflects the substrate temperature.
Solution Approach 2:
The thermal properties of the support plate are modified by attaching a material with high thermal conductivity. This changes the heat transfer parameters, allowing the support plate to rapidly and uniformly transfer heat to the substrate, making the support plate temperature a reliable indicator of substrate temperature.
2Measurement precision
If temperature correction work is performed to correct the difference between measured and actual temperature, then measurement accuracy may be improved, but the setup process becomes more complex and time-consuming
Solution Approach 1:
The complex temperature correction system is eliminated by extracting the root cause of the temperature discrepancy. Instead of adding correction mechanisms, the design directly addresses the problem by ensuring the support plate temperature accurately reflects the substrate temperature through improved thermal coupling.
Solution Approach 2:
The support plate structure is designed to automatically ensure accurate temperature measurement without requiring external correction systems. The thermal conductor material self-adjusts the heat transfer to make the support plate temperature a reliable proxy for substrate temperature.
3Productivity
If the support plate is heated to achieve uniform temperature across the substrate, then heating efficiency is improved, but accurate temperature control becomes difficult due to measurement discrepancies
Solution Approach 1:
The thermal conductor serves as a mediator that ensures uniform heat distribution across the substrate while maintaining an accurate temperature relationship between the support plate and substrate. This allows the heating system to efficiently heat the substrate while the temperature sensor accurately monitors the actual substrate temperature.
Solution Approach 2:
The thermal conductivity parameter of the support plate assembly is enhanced by adding the thermal conductor material. This parameter change enables rapid and uniform heat distribution across the substrate, improving heating efficiency while maintaining accurate temperature control through the temperature sensor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise temperature measurement and control of the substrate, reducing setup time and eliminating the need for temperature correction work, thereby improving the consistency and accuracy of the heat treatment process.
Implementation Method 1
an elastic member to apply elastic force to the support protrusion in a direction that the support protrusion faces the substrate
Implementation Method 2
a heater unit to heat the substrate supported by the substrate support unit
Data Source
AI summary
An apparatus for treating a substrate are provided. The apparatus includes a chamber having a treatment space therein, a substrate support unit to support the substrate in the treatment space, and a heater unit to heat the substrate supported by the substrate support unit. The substrate support unit includes a support plate having a seating surface, a support protrusion provided to protrude from the seating plate and to directly support the substrate, and a sensor provided to the support protrusion to measure a temperature of the substrate.