Substrate Support Plate Recess Design for Vibration Control

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Solution Overview

Problem

Existing substrate treating apparatuses face challenges in minimizing vibration and stabilizing substrate positioning during lifting due to pressure differences and limited heat transfer, which affects the photolithographic process in semiconductor device manufacturing.

Innovation Solution

The apparatus incorporates a substrate support unit with a passage and recess design on the support plate, allowing for improved gas flow and heat transfer, and features lift pins and a temperature adjusting unit to stabilize the substrate during heating and cooling processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the support boss height is increased to prevent substrate contact, then substrate positioning stability is improved, but heat transfer efficiency deteriorates and space between cooling plate and substrate is reduced

Engineering Contradiction:
Improvesubstrate positioning stabilityVSAvoidheat transfer efficiency
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The invention transitions from vertical support (support boss) to peripheral support through recesses at the edge of the support plate. This dimensional change allows the substrate to be supported at its perimeter rather than requiring vertical protrusions, thereby maintaining positioning stability while preserving thermal contact area and heat transfer efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If lift pin moves substrate through pin hole, then substrate lifting function is achieved, but gas flow in space between support plate and substrate is blocked causing pressure difference

Engineering Contradiction:
Improvesubstrate lifting functionVSAvoidgas flow
Core Design Contradiction:
Ease of operationVSQuantity of substance

Solution Approach 1:

The invention extracts the substrate support function from the central pin hole mechanism and relocates it to peripheral recesses. This allows the lift pin to operate through the pin hole without interfering with gas flow paths, as the support and lifting functions are separated from the gas flow region between the support plate and substrate.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If pin hole is used for lift pin elevation, then substrate lifting is enabled, but substrate vibration occurs due to pressure difference between space and exterior

Engineering Contradiction:
Improvesubstrate liftingVSAvoidsubstrate vibration
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The recesses act as intermediary structures that facilitate substrate support and lifting while mediating gas flow. By providing peripheral support points through recesses rather than central pin hole support, the system enables lifting function while maintaining pressure equilibrium, thereby eliminating substrate vibration caused by pressure differences.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design minimizes substrate vibration and ensures stable positioning, enhancing the efficiency and accuracy of photolithographic processes by facilitating smoother gas flow and effective temperature control.

Implementation Method 1

a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate

Methodology Applied
Scientific EffectGas flow:

Implementation Method 2

a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage

Methodology Applied
Scientific EffectGas flow:

Implementation Method 3

a temperature adjusting member configured to adjust the temperature of the substrate supported by the support plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10763152B2Substrate support unit, heat treatment unit, and substrate treating apparatus including the same
Publication Date: 2020.09.01 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US10763152B2 patent drawing
  • US10763152B2 patent drawing
  • US10763152B2 patent drawing

AI summary

Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.