Substrate Support RF Cleaning Without Breaking Vacuum

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in efficiently cleaning the substrate support without disrupting the vacuum state or requiring downtime, as conventional methods often result in non-uniform cleaning and increased maintenance costs due to the need for replacing components.

Innovation Solution

A substrate processing apparatus with a freezing device that can be contacted or separated from the substrate support, allowing for controlled supply and stop of RF power, enabling in-situ cleaning using a separate RF power supply line to uniformly clean the substrate support during idle states.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a separate power supply line is provided for the freezing device, then RF power can be controlled independently during cleaning, but device complexity increases

Engineering Contradiction:

Improvecontrolled supply and stop of RF powerVSAvoidseparate power supply line

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The power supply system is segmented into a main power supply for the substrate support and a separate power supply line specifically for the freezing device. This segmentation allows independent control of RF power to the freezing device, enabling precise control during cleaning operations without affecting the main substrate support power supply.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A separate power supply line acts as an intermediary between the RF power source and the freezing device. This intermediary connection enables selective and controlled power delivery to the freezing device during cleaning cycles, providing operational flexibility while maintaining system modularity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the substrate support is cleaned by separating it from the substrate, then cleaning effectiveness improves, but processing time increases

Engineering Contradiction:

Improvecleaning uniformityVSAvoiddowntime

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The cleaning function is prepared in advance by providing a dedicated power supply line for the freezing device. This preliminary setup allows the cleaning operation to be executed quickly and efficiently when needed, as the power delivery path is already established and optimized for cleaning operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate support can be cleaned during idle states without breaking the vacuum, maintaining continuous operational readiness. The separate power supply line enables the cleaning function to be integrated into the operational cycle without requiring system shutdown or vacuum breaking, thus maintaining continuity of useful action.

Inventive Principle:

Principle #20Continuity of useful action

3Productivity

If RF power is supplied during cleaning, then cleaning efficiency improves, but risk of damage to substrate support increases

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidsubstrate support damage

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The control system monitors the state of the substrate support and substrate relative position, and provides feedback to adjust RF power supply to the freezing device. This feedback mechanism ensures that RF power is supplied at appropriate levels during cleaning operations, maximizing cleaning efficiency while preventing damage to the substrate support.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The RF power supply to the freezing device is made dynamic and adjustable based on operational conditions. The separate power supply line enables real-time modulation of power levels during cleaning, allowing the system to adapt power delivery to the specific cleaning needs and substrate support condition, thereby improving cleaning efficiency while maintaining safety.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient, uniform cleaning of the substrate support without breaking the vacuum, reducing maintenance costs and downtime, while maintaining high film formation efficiency and quality.

Implementation Method 1

a freezing device that is in contact with or separated from the substrate support and is configured to cool the substrate support

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the deposits deposited on the substrate support are removed after the separating step by supplying a radio frequency (RF) power from an RF power supply to the substrate support and generating plasma

Methodology Applied

Scientific EffectPlasma generation: Plasma

Data Source

PatentUS12531219B2Substrate processing apparatus and cleaning method

Publication Date: 2026.01.20 TOKYO ELECTRON LTD

AI summary

Provided is a substrate processing apparatus comprising a processing chamber, a rotatable substrate support configured to hold a substrate in the processing chamber, a freezing device that is in contact with or separated from the substrate support and is configured to cool the substrate support, a mechanism configured to rotate the substrate support and raise and lower the freezing device, a power supply part configured to supply a radio frequency (RF) power, and a power supply line that penetrates through the freezing device, has a contact portion, and is configured to switch supply and stop of supply of the RF power by connecting the contact portion to a specific position of the substrate support or disconnecting the contact portion from the specific position of the substrate support.