Substrate Support Ring Radial Extension for Uniform Oxide Growth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor fabrication processes often experience non-uniformity in layer thickness at the substrate edge due to varying deposition or growth rates, leading to process non-uniformities during oxide layer deposition or growth.
Innovation Solution
A substrate support ring design with an outer ring extending radially beyond the support surface by 24 mm to 45 mm, providing a reaction surface area that is generally parallel to the support plane, helps to enhance process uniformity by positioning the peripheral edge of the substrate within the effective combustion reaction region, thereby reducing edge roll-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional substrate support ring is used, then the substrate can be supported during processing, but non-uniform layer thickness occurs at the substrate edge due to varying deposition or growth rates
Solution Approach 1:
The patent extends the reaction surface radially outward beyond the substrate edge in the radial dimension, creating an annular reaction surface that positions the substrate peripheral edge within the effective combustion reaction region. This dimensional extension allows the reaction surface to overlap with the substrate edge region, thereby improving layer thickness uniformity at the substrate edge by ensuring consistent combustion reaction coverage across the entire substrate surface including the peripheral edge.
2Manufacturing precision
If the reaction surface extends significantly beyond the substrate, then edge roll-off is reduced, but chamber size and production costs increase
Solution Approach 1:
The patent specifies that the reaction surface extends beyond the substrate support surface by a controlled distance of about 24 mm to about 45 mm radially outward. This parameter optimization ensures sufficient extension to position the substrate peripheral edge within the effective combustion reaction region and reduce edge roll-off, while avoiding excessive extension that would unnecessarily increase chamber volume and production costs. The elevation of the reaction surface about 0.86 to about 0.97 mm above the support surface further optimizes the combustion reaction positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described substrate support ring design improves layer thickness uniformity by minimizing edge roll-off, maintaining acceptable layer growth across the substrate, even at varying temperatures, while optimizing production costs and chamber requirements.
Implementation Method 1
a combustion reaction is initiated in a process chamber to generate oxygen species to contribute to the growth of the oxide layer
Implementation Method 2
a combustion reaction is initiated in a process chamber to generate oxygen species to contribute to the growth of the oxide layer
Data Source
AI summary
Embodiments of substrate support rings providing more uniform thickness of layers deposited or grown on a substrate are provided herein. In some embodiments, a substrate support ring includes: an inner ring with a centrally located support surface to support a substrate; and an outer ring extending radially outward from the support surface, wherein the outer ring comprises a reaction surface area disposed above and generally parallel to a support plane of the support surface, and wherein the reaction surface extends beyond the support surface by about 24 mm to about 45 mm.