Substrate Support with Segmented Sealing Gap
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Solution Overview
Problem
Substrate contamination occurs due to contact with certain substrate support materials during semiconductor fabrication, and there is a need to reduce thermal conduction and achieve uniform temperature profiles.
Innovation Solution
A substrate support design featuring a support plate with a support surface, a support ring, and spherical non-metallic first and second support elements that create controlled gaps to minimize contact and reduce thermal conduction, using materials like aluminum oxide or ceramic to prevent metal contamination and ensure uniform temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate contact with substrate support materials is increased to improve sealing, then sealing effectiveness is improved, but substrate contamination increases
Solution Approach 1:
The substrate support structure is segmented into multiple components: a support plate, a support ring, and multiple discrete support elements. This segmentation allows the sealing function to be distributed across several elements rather than requiring extensive contact between the substrate and a single continuous support surface, thereby reducing contamination while maintaining sealing effectiveness.
Solution Approach 2:
The support elements act as intermediaries between the substrate and the support plate. These intermediate elements provide the necessary support and sealing while minimizing direct contact between the substrate and the support plate material, thus reducing substrate contamination from metal contact.
2Object-affected harmful factors
If substrate contact with substrate support materials is reduced to eliminate contamination, then substrate contamination is reduced, but sealing effectiveness deteriorates
Solution Approach 1:
The support elements are strategically positioned at specific locations where sealing is most critical. Each support element is designed with specific local properties (spherical shape, non-metallic material) optimized for its sealing function, providing effective sealing only where needed rather than requiring extensive contact across the entire substrate surface.
3Stress or pressure
If continuous contact between substrate and support plate is used to maintain uniform pressure, then pressure uniformity is improved, but thermal conduction increases causing temperature non-uniformity
Solution Approach 1:
The continuous contact interface is segmented into discrete support elements. This segmentation interrupts the thermal conduction path between the substrate and support plate while maintaining pressure uniformity through the distributed arrangement of support elements, thereby reducing temperature non-uniformity caused by excessive thermal conduction.
4Strength
If metal substrate support materials are used to provide structural support, then structural strength is improved, but metal contamination of substrate occurs
Solution Approach 1:
Non-metallic support elements serve as intermediaries between the substrate and the metal support plate. These intermediate elements provide the necessary structural support and sealing functions while preventing direct contact between the substrate and metal materials, thus eliminating metal contamination of the substrate.
Solution Approach 2:
The substrate support structure uses a composite arrangement combining metal (support plate for structural strength) and non-metallic materials (support elements for substrate contact). This composite structure allows each material to perform its optimal function while avoiding the harmful effects of metal-substrate contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces substrate contamination, minimizes thermal conduction, and maintains a controlled sealing gap for uniform pressure, resulting in improved temperature uniformity and reduced metal contamination.
Implementation Method 1
spherical non-metallic first and second support elements that create controlled gaps to minimize contact and reduce thermal conduction
Implementation Method 2
facilitate formation of a vacuum between a backside of the substrate and the support surface to chuck the substrate to the substrate support
Data Source
AI summary
Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of the plurality of first support elements.