Substrate Support Assembly with Segmented Heater Zones
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Solution Overview
Problem
Conventional substrate processing chambers lack the ability to rapidly change substrate temperature during a single process cycle, leading to non-uniform processing conditions and variations in properties across the substrate surface, which is undesirable for achieving specific temperature profiles required in etching and deposition processes.
Innovation Solution
A substrate support assembly with a ceramic puck embedded with an electrode and heater coils, coupled with a compliant silicon layer and fluid channels for temperature control, allowing for rapid temperature ramping and uniform heat distribution across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional substrate processing chambers use a single temperature control system, then the substrate can be maintained at a steady temperature during processing, but the substrate temperature cannot be rapidly changed during a single process cycle
Solution Approach 1:
The substrate support assembly is divided into multiple independently controllable heating zones (e.g., first heating zone, second heating zone) with separate temperature control systems. Each zone can be controlled at different temperatures simultaneously, allowing complex temperature profiles to be achieved during processing while maintaining overall temperature stability when needed.
2Stability of the object's composition
If conventional chambers maintain uniform substrate temperature, then processing stability is improved, but non-uniform processing bands appear due to radial variations in process conditions
Solution Approach 1:
Different regions of the substrate are exposed to different temperatures by controlling each heating zone independently. This compensates for radial variations in process conditions (such as gas distribution and plasma density) by applying localized temperature adjustments, thereby eliminating non-uniform processing bands and improving overall processing uniformity across the substrate surface.
3Productivity
If rapid temperature ramping is implemented, then different materials can be etched at different temperatures in the same process cycle, but the temperature control system complexity increases
Solution Approach 1:
The heating zones are designed to be dynamically controllable, allowing rapid switching between different temperature setpoints for each zone. This enables multi-step processes (such as etching different materials at different temperatures) to be performed in a single process cycle without requiring physical reconfiguration, thereby improving productivity while managing complexity through electronic control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and precise temperature control, reducing non-uniform processing bands and allowing for efficient etching and deposition of different materials by maintaining independent temperature zones on the substrate, thereby improving process uniformity and efficiency.
Implementation Method 1
an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface
Implementation Method 2
a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils
Implementation Method 3
The electrostatic chuck can be supported by a base which has channels for passing a fluid therethrough to cool or heat the chuck
Implementation Method 4
the temperature of the substrate is controlled by maintaining helium gas behind the substrate to enhance heat transfer rates across the microscopic gaps at the interface between the back of the substrate and the surface of the chuck
Data Source
AI summary
A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.