Substrate Support Plate with Segmented Plateaus and Ventilation Channels
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Solution Overview
Problem
Existing substrate carriers for semiconductor wafers can cause adverse effects on the substrate's properties, such as electrical conductivity, due to the formation of pedestals during plasma processes, and may lead to substrate tilting and inhomogeneous processing, resulting in damage or coating inhomogeneities.
Innovation Solution
A substrate carrier with a front surface featuring an inner and outer area, where the outer area has raised plateaus for supporting edge regions and ventilation channels between them, allowing for secure substrate placement and easy, non-destructive removal by preventing gas cushion formation and ensuring uniform ventilation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circumferential free space and pedestal structure are used to hold the substrate, then the substrate can be securely held in place, but the pedestal is reproduced on the substrate during plasma processes, adversely affecting substrate properties such as electrical conductivity
Solution Approach 1:
The substrate support surface is segmented into multiple discrete support areas (first and second substrate support areas) at different height levels, rather than using a single continuous pedestal. This segmentation prevents the formation of a uniform pedestal structure that would be reproduced on the substrate, while still providing stable support through distributed contact points.
Solution Approach 2:
Different regions of the substrate support surface are given different height levels and support characteristics. The first substrate support areas are at a higher level while the second substrate support areas are at a lower level, creating localized support zones that prevent uniform pedestal formation and allow selective contact with the substrate to avoid harmful reproductions.
2Ease of operation
If a circumferential free space is provided for ventilation, then ventilation after vacuum process is enabled, but the substrate can tilt into the circumferential depression, causing damage and inhomogeneities in processing
Solution Approach 1:
The support structure is segmented into multiple discrete support areas rather than a continuous surface, creating controlled free spaces between them. This segmentation enables ventilation channels to be formed for gas flow while the distributed support areas prevent substrate tilting by providing multiple stable contact points around the substrate perimeter.
Solution Approach 2:
The support structure utilizes vertical height differentiation (first support areas at higher level, second support areas at lower level) to create a three-dimensional support configuration. This dimensional approach allows ventilation channels to exist in the spaces between support areas while maintaining substrate stability through multi-level contact points.
3Ease of operation
If a continuous opening is provided in the substrate carrier plate for central ventilation, then gas flow is enabled, but the substrate support structure becomes complex and manufacturing difficulty increases
Solution Approach 1:
Instead of providing a single continuous opening in the substrate carrier plate, the ventilation function is segmented into multiple discrete ventilation channels formed between the first and second substrate support areas. This segmentation simplifies manufacturing by avoiding complex continuous openings while still enabling effective gas flow through multiple smaller channels distributed across the support structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate carrier provides stable, plane-parallel support for substrates, prevents slipping, and facilitates safe and quick handling by allowing gas to escape through ventilation channels, maintaining substrate integrity and processing quality.
Implementation Method 1
ventilation channels being provided between the plateaus, and with the ventilation channels being designed as grooves aligned parallel or perpendicular to one another
Data Source
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AI summary
The present invention relates to a substrate support with a substrate support plate which has a front substrate support surface on which at least one substrate-receiving area is provided for receiving a respective substrate. The object of the present invention is to propose a substrate support which, as far as possible without impairing the properties of the substrate or the working of the substrate, ensures a secure application of the substrate and, while permitting rapid handling, allows the substrate to be easily removed from the substrate support without being destroyed. According to the invention, the object is achieved by the fact that the substrate-receiving area has an inner area and an outer area extending around the inner area, wherein the outer area has plateaus which are spaced apart from each other and elevated above a surface of the inner area and serve to carry edge areas of the substrate, wherein ventilation channels are provided between the plateaus.