Substrate Support Sensor Tube for Edge Temperature Sensing
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Solution Overview
Problem
Current methods for positioning temperature sensors in substrate supports within process chambers, such as semiconductor process chambers, are challenging and expensive, particularly when the sensor is located near the outer edge, often requiring diffusion bonding of separate plates which is costly and time-consuming.
Innovation Solution
A method involving embedding a tube with a higher melting point than the sintering material in the substrate support body during sintering, allowing easy access for sensor placement after sintering, and forming a cavity between partially sintered plates to accommodate the sensor, thereby avoiding costly diffusion bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If diffusion bonding of separate plates is used to position sensors near the outer edge of substrate support, then sensor positioning capability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
A tube structure is embedded into the substrate support body during the sintering process before the sensor is installed. This preliminary embedding creates a pre-formed cavity that guides sensor placement, eliminating the need for complex post-manufacturing diffusion bonding operations while maintaining precise sensor positioning capability near the outer edge
2Measurement precision
If sensors are positioned near the outer edge of substrate support, then process control capability is improved, but manufacturing difficulty increases
Solution Approach 1:
The tube is embedded during sintering to create a pre-positioned cavity that extends to the outer edge region, allowing the sensor to be placed at the optimal location for process control measurements without requiring complex manufacturing steps to achieve the positioning
Solution Approach 2:
The tube acts as an intermediary structure that facilitates sensor placement near the outer edge. It serves as a mediator between the sintering process and the final sensor installation, enabling precise positioning while simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective integration of sensors near the outer edge of substrate supports by simplifying the manufacturing process and reducing the need for expensive diffusion bonding, enhancing process control in semiconductor process chambers.
Implementation Method 1
a tube positioned inside the substrate support body, the tube formed of a second material having a melting point that is higher than a sintering temperature of the first material
Data Source
AI summary
A substrate support assembly is provided including: a shaft; and a substrate support including: a substrate support body attached to the shaft, the substrate support body formed of a first material; and a tube positioned inside the substrate support body, the tube formed of a second material having a melting point that is higher than a sintering temperature of the first material.