Rotating Substrate Support Plate With Static Charge Discharge
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Solution Overview
Problem
Static electricity is generated during the spin-type processing of substrates in semiconductor manufacturing, leading to issues such as arcing damage and reattachment of particles, which can adversely affect equipment operation and substrate quality.
Innovation Solution
A support unit with a rotatable support plate and pin members, equipped with a conductive discharge member that discharges static charges to the air as the support plate rotates, effectively mitigating static electricity buildup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a chemical liquid is supplied to the substrate during rotation in a spin-type processing apparatus, then the substrate cleaning effectiveness is improved, but static electricity is generated causing arcing damage and particle reattachment
Solution Approach 1:
A conductive member is introduced as an intermediary between the substrate and ground. The conductive member contacts the substrate and provides a controlled path for static charge dissipation, preventing charge buildup that would otherwise cause arcing damage and particle reattachment while allowing the chemical liquid cleaning process to continue effectively
Solution Approach 2:
The patent replaces the purely mechanical/chemical cleaning system with an electrostatically-controlled system. By introducing the conductive member that actively manages static charge, the system transitions from passive mechanical spinning and chemical application to an active electrostatic control mechanism that prevents harmful effects
2Area of stationary object
If the substrate is rotated during chemical liquid supply, then the chemical liquid spreads over the entire substrate surface, but static electricity accumulates due to friction and chemical interaction
Solution Approach 1:
The conductive member is positioned to contact the substrate before significant static charge accumulation occurs. By establishing the charge dissipation path in advance, the system prevents static electricity buildup rather than addressing it after damage has occurred, maintaining both coverage and reliability
3Object-affected harmful factors
If a conductive line is used to discharge static electricity through the chucking pin and rotating shaft, then arcing damage is prevented, but the system complexity increases
Solution Approach 1:
The patent extracts the essential function of static charge dissipation from the complex conductive line system and implements it through a simpler conductive member that directly contacts the substrate. This eliminates the need for conductive lines connecting the chucking pin and rotating shaft, reducing system complexity while maintaining arcing damage prevention
Solution Approach 2:
The conductive member provides self-service static charge dissipation by directly contacting the substrate and providing a natural discharge path to ground. The system serves itself by using the substrate-contacting component as the discharge path, eliminating the need for separate complex conductive line infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described solution effectively discharges static electricity generated during substrate processing, preventing damage from arcing and particle reattachment, thereby improving equipment reliability and substrate quality.
Implementation Method 1
a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member
Data Source
AI summary
The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.