Substrate Support for High Throughput Chemical Treatment
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Solution Overview
Problem
Current high-throughput chemical treatment systems for substrates suffer from low throughput in non-plasma processes, limiting their practicality due to the need for single substrate processing, which hampers the efficient processing of multiple substrates simultaneously.
Innovation Solution
A high-throughput chemical treatment system with a substrate holder capable of supporting multiple substrates, featuring a temperature-controlled substrate table with integrated fluid channels and thermal management, along with a dedicated handler for efficient processing and transfer, allowing for simultaneous chemical and thermal treatment of multiple substrates in a dry, non-plasma environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single substrate processing cluster tool is used, then consistent and repeatable process characteristics are achieved, but throughput is low
Solution Approach 1:
The substrate processing system is segmented into multiple independent processing modules (first process module, second process module, etc.), each capable of processing substrates independently. This allows parallel processing of multiple substrates across different modules while maintaining consistent process characteristics within each module, thereby increasing overall throughput without sacrificing process reliability.
Solution Approach 2:
The substrate processing system is designed with universal process modules that can handle multiple substrate types and processing operations. The system includes a substrate transfer station and multiple process modules that can process different substrates through similar process flows, enabling the system to maintain consistent process characteristics across diverse substrate processing while achieving high throughput through parallel operations.
2Manufacturing precision
If chemical removal process is used, then high selectivity is achieved, but throughput is low
Solution Approach 1:
The chemical removal process is divided into separate process modules within the cluster tool system. Each module is equipped with chemical treatment chambers that can process substrates independently using highly selective chemical removal processes. By segmenting the process into multiple parallel modules, the system maintains the high selectivity of chemical removal while increasing overall throughput through simultaneous processing of multiple substrates in different modules.
Solution Approach 2:
The system implements continuous substrate processing through a coordinated sequence of operations across multiple process modules. Substrates move continuously through the cluster tool system, undergoing chemical removal processes in one module while other modules simultaneously process additional substrates. This continuous flow approach eliminates idle time and maintains high throughput while preserving the selective chemical removal capability in each module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly enhances the throughput of chemical and thermal treatments for substrates, enabling efficient processing of multiple substrates while maintaining consistent and repeatable process characteristics, thereby improving the overall efficiency and productivity of substrate treatment.
Implementation Method 1
a fluid channel formed within an interior of the temperature-controlled substrate table... configured to receive the heat transfer fluid from the fluid thermal unit and supply the heat transfer fluid to an inlet end of the fluid channel
Implementation Method 2
two or more support columns configured to support the temperature-controlled substrate table at a distance from a wall of the chemical treatment chamber
Data Source
AI summary
A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. A substrate support in the chemical treatment system is configured to support a plurality of substrates.