Substrate Support Table Heat Transfer Protrusions Lithography

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Solution Overview

Problem

Lithographic apparatuses face challenges in accurately positioning substrates due to thermal expansion and contraction, leading to overlay errors during the lithographic process, as existing substrate support systems provide poor thermal contact, resulting in significant temperature variations.

Innovation Solution

The introduction of a substrate support table with a plurality of support protrusions and heat transfer protrusions that extend towards the substrate without contacting it, creating gas-containing heat exchanging gaps for efficient heat transfer via gas conduction, and a similar configuration between the support table and chuck to enhance thermal conditioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If support protrusions are used to support the substrate, then the substrate can be positioned accurately and contamination is prevented, but thermal contact is poor leading to significant temperature variations

Engineering Contradiction:
Improvesubstrate positioning accuracyVSAvoidthermal variations of substrate
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The support table is segmented into multiple discrete support protrusions distributed across its surface. Each protrusion provides localized support while maintaining positional accuracy. The segmented structure allows heat to be transferred through multiple contact points rather than a single large contact area, improving thermal coupling while preserving positioning precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Heat transfer protrusions are added as a new dimensional element extending toward the substrate without making full contact. These protrusions create gas-filled gaps that enable thermal conduction through the gas medium, adding a new dimension of heat transfer capability independent of direct solid-to-solid contact.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If heat transfer protrusions extend towards the substrate without contacting it, then thermal coupling is improved via gas conduction, but device complexity increases

Engineering Contradiction:
Improvethermal coupling between substrate and support tableVSAvoidcomplexity of support table structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat transfer protrusions are merged with the support protrusions, forming an integrated structure where both functions coexist. The support protrusions provide mechanical support and positioning, while the heat transfer protrusions extend from the same structure to provide thermal coupling through gas conduction. This merging eliminates the need for separate components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support table structure is designed with multi-functionality, where the protrusions serve dual purposes: mechanical support/positioning and thermal coupling. The same structural elements that provide substrate support also facilitate heat transfer, reducing the need for additional dedicated components and simplifying the overall device.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If gas-containing heat exchanging gaps are created between heat transfer protrusions and substrate, then heat transfer efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidgap uniformity between protrusions and substrate
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The gap dimensions between heat transfer protrusions and the substrate are optimized to specific parameter ranges that maximize gas conduction efficiency. By controlling the gap size within defined parameters, the system achieves effective thermal coupling while accommodating normal manufacturing tolerances. The gas pressure and composition are also parameters that can be adjusted to optimize heat transfer.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves the thermal coupling of the substrate with the support table and chuck, reducing thermal variations and overlay errors, allowing for more accurate and stable substrate positioning and patterning during lithographic processes.

Implementation Method 1

Gas-containing heat exchanging gaps for exchanging heat with the substrate extend between the heat transfer protrusions and the substrate

Methodology Applied
Scientific EffectGas conduction: Conduction (thermal)

Data Source

PatentUS7532310B2Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
Publication Date: 2009.05.12 ASML NETHERLANDS BV
  • US7532310B2 patent drawing
  • US7532310B2 patent drawing
  • US7532310B2 patent drawing

AI summary

An apparatus includes a support table for supporting a substrate. The support table includes a plurality of support protrusions that contact the substrate during use for supporting the substrate. The support table includes a plurality of heat transfer protrusions that extend towards the substrate during use without contacting the substrate when the substrate is supported by the support protrusions. Gas-containing heat exchanging gaps for exchanging heat with the substrate extend between the heat transfer protrusions and the substrate.