Substrate Support Temperature Calculation via Virtual Sensing
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Solution Overview
Problem
Substrate processing systems face challenges in implementing effective temperature control for substrate supports due to high power configurations that interfere with electrical components, leading to issues such as plasma arcing and generation failure, and the absence of integrated temperature sensors makes precise temperature measurement difficult.
Innovation Solution
A temperature controller system that calculates the substrate support temperature using power parameters, coolant temperature parameters, and heat transfer gas parameters, allowing for virtual temperature sensing without the need for integrated sensors, and adjusts coolant and heat transfer gas flows based on calculated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If integrated temperature sensors are installed in the substrate support, then temperature measurement precision is improved, but device complexity and risk of plasma arcing increase
Solution Approach 1:
The patent introduces an intermediary calculation system that uses multiple existing sensor measurements (power parameters, coolant temperature, heat transfer gas flow rates) to indirectly determine substrate support temperature. This mediator approach avoids direct sensor installation on the substrate support, eliminating the complexity and plasma arcing risks while achieving accurate temperature measurement through computational inference.
Solution Approach 2:
The patent replaces the mechanical/electrical temperature sensor system with a computational system that calculates temperature based on thermal model parameters. This substitution eliminates the need for physical temperature sensors in the high-power RF environment, reducing device complexity and avoiding plasma interference issues.
2Measurement precision
If integrated temperature sensors are installed in the substrate support, then temperature measurement precision is improved, but reliability decreases due to plasma arcing and generation failure
Solution Approach 1:
The patent introduces an intermediary calculation system that uses multiple existing sensor measurements (power parameters, coolant temperature, heat transfer gas flow rates) to indirectly determine substrate support temperature. This mediator approach avoids direct sensor installation on the substrate support, eliminating the complexity and plasma arcing risks while achieving accurate temperature measurement through computational inference.
3Device complexity
If virtual temperature sensing is implemented, then device complexity is reduced, but measurement precision may be compromised
Solution Approach 1:
The patent implements a feedback-based thermal model that continuously calculates substrate support temperature using real-time measurements of power parameters, coolant temperature, and heat transfer gas flow rates. The system uses modification factors that can be adjusted based on observed temperature deviations, creating a self-correcting measurement system that maintains high precision without requiring additional hardware sensors.
Solution Approach 2:
The patent creates a universal temperature measurement system that uses existing multi-functional sensors (power sensors, coolant temperature sensors, gas flow sensors) already present in the substrate processing system. By making these existing sensors serve the additional function of virtual temperature sensing, the system achieves precise temperature measurement without adding device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature control of substrate supports in substrate processing systems, preventing plasma arcing and ensuring reliable plasma generation by calculating substrate support temperatures using power, coolant, and heat transfer gas parameters, thereby improving processing efficiency.
Implementation Method 1
The substrate support may include a plurality of channels to provide a heat transfer gas (e.g., helium) to a backside of the substrate arranged on the ceramic layer. The heat transfer gas facilitates cooling of the substrate and/or the ceramic layer.
Implementation Method 2
The substrate support may include a plurality of channels to provide a heat transfer gas (e.g., helium) to a backside of the substrate arranged on the ceramic layer. The heat transfer gas facilitates cooling of the substrate and/or the ceramic layer.
Data Source
AI summary
A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.